Shu MATSUURA

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Ishikawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat sink and electronic component package
- Patent number 10,499,537
- Issue date Dec 3, 2019
- KAGA, INC.
- Masaaki Nozaki
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HEATSINK, METHOD FOR MANUFACTURING HEATSINK, AND ELECTRONIC COMPONE...
- Publication number 20230320037
- Publication date Oct 5, 2023
- KAGA, INC.
- Masaaki NOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20220167532
- Publication date May 26, 2022
- KAGA, INC.
- Yousuke NAKAMURA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SINK AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20190335614
- Publication date Oct 31, 2019
- KAGA, INC.
- Masaaki NOZAKI
- F28 - HEAT EXCHANGE IN GENERAL