Shu W. Wang

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Rochester, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for measuring wafer thickness
- Patent number 7,283,256
- Issue date Oct 16, 2007
- Chapman Instruments, Inc.
- Thomas C. Bristow
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for measuring wafer thickness
- Patent number 7,280,232
- Issue date Oct 9, 2007
- Chapman Instruments, Inc.
- Thomas Bristow
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for measuring wafer thickness
- Publication number 20060181715
- Publication date Aug 17, 2006
- Chapman Instruments
- Thomas C. Bristow
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for measuring wafer thickness
- Publication number 20060061775
- Publication date Mar 23, 2006
- Chapman Instruments
- Thomas Bristow
- G01 - MEASURING TESTING