Shu-Wei HSIAO

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Zhudong Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board structure with heat dissipation function
- Patent number 9,554,453
- Issue date Jan 24, 2017
- Mediatek Inc.
- Shu-Wei Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...
- Publication number 20240304534
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Shu-Wei HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE WITH HEAT DISSIPATION FUNCTION
- Publication number 20140238729
- Publication date Aug 28, 2014
- MEDIATEK INC.
- Shu-Wei HSIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR