Shu-Ying Lu

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Structure of a bonding pad for semiconductor devices
- Patent number 6,100,573
- Issue date Aug 8, 2000
- United Integrated Circuits Corp.
- Chang-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating mixed-mode device
- Patent number 6,030,872
- Issue date Feb 29, 2000
- United Integrated Circuits Corp.
- Jau-Hone Lu
- H01 - BASIC ELECTRIC ELEMENTS