Shu-Yuan Chin

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Graphene liners and caps for semiconductor structures
- Patent number 12,255,144
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact structure
- Patent number 12,237,261
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium-based liner for a copper interconnect
- Patent number 12,094,770
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a contact structure
- Patent number 11,996,361
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium oxide film and ruthenium liner for low-resistance copper...
- Patent number 11,749,604
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming thereof
- Patent number 11,742,290
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and method of making
- Patent number 11,652,044
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan linear speed controller
- Patent number 6,380,704
- Issue date Apr 30, 2002
- Silicon Touch Technology Inc.
- Shu-Yuan Chin
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Brushless DC fan driver with overshoot voltage prevention and enhan...
- Patent number 6,140,782
- Issue date Oct 31, 2000
- Silicon Touch Technology Inc.
- Shu-Yuan Chin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Brushless DC fan driver with an integral overall protection capability
- Patent number 6,023,139
- Issue date Feb 8, 2000
- Tai E International Patent and Law Office
- Shu-Yuan Chin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT CONDUCTIVE STRUCTURE FOR CIRCUIT PROBE TESTING
- Publication number 20250076340
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20240413087
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20240387256
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES
- Publication number 20240387259
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387381
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME
- Publication number 20240379430
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY
- Publication number 20240186235
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20230361039
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...
- Publication number 20230361040
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20230299002
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphite-Based Interconnects And Methods Of Fabrication Thereof
- Publication number 20230275024
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE
- Publication number 20230275019
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230223344
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LINERS AND CAPS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20230154850
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES
- Publication number 20230154792
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20230068398
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHOD FOR PASSIVATION LAYER FORM...
- Publication number 20230042277
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Pang KUO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE STRUCTURES WITH BOTTOM-LESS BARRIERS AND LINERS
- Publication number 20230029867
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONTACT STRUCTURE
- Publication number 20220384338
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure Including Graphite and Method Forming Same
- Publication number 20220367266
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20220293528
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND METHOD OF MAKING
- Publication number 20220278040
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...
- Publication number 20220246535
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20220246534
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device
- Publication number 20220165616
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS

Shu-Yuan Chin

Person

Patents Grantslast 30 patents

Graphene liners and caps for semiconductor structures

Semiconductor device having a contact structure

Method of forming interconnect structure having a barrier layer

Ruthenium-based liner for a copper interconnect

Method of making a contact structure

Ruthenium oxide film and ruthenium liner for low-resistance copper...

Interconnect structure and method of forming thereof

Contact structure and method of making

Fan linear speed controller

Brushless DC fan driver with overshoot voltage prevention and enhan...

Brushless DC fan driver with an integral overall protection capability

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT CONDUCTIVE STRUCTURE FOR CIRCUIT PROBE TESTING

Interconnect Structure and Method of Forming Thereof

LOW-RESISTANCE COPPER INTERCONNECTS

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME

INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY

Interconnect Structure and Method of Forming Thereof

RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

Graphite-Based Interconnects And Methods Of Fabrication Thereof

SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

GRAPHENE LINERS AND CAPS FOR SEMICONDUCTOR STRUCTURES

CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

SEMICONDUCTOR PROCESSING TOOL AND METHOD FOR PASSIVATION LAYER FORM...

CONDUCTIVE STRUCTURES WITH BOTTOM-LESS BARRIERS AND LINERS

METHOD OF MAKING A CONTACT STRUCTURE

Interconnect Structure Including Graphite and Method Forming Same

Interconnect Structure and Method of Forming Thereof

CONTACT STRUCTURE AND METHOD OF MAKING

RUTHENIUM OXIDE FILM AND RUTHENIUM LINER FOR LOW-RESISTANCE COPPER...

LOW-RESISTANCE COPPER INTERCONNECTS

Interconnect Structure of Semiconductor Device