Shuai GUO

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Wuhan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding method and structure thereof
- Patent number 11,342,185
- Issue date May 24, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for wafer bonding alignment compensation
- Patent number 10,886,256
- Issue date Jan 5, 2021
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer bonding method and structure thereof
- Patent number 10,679,854
- Issue date Jun 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for adjusting wafer deformation during wafer bo...
- Patent number 10,553,565
- Issue date Feb 4, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and systems for wafer bonding alignment compensation
- Patent number 10,529,694
- Issue date Jan 7, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20200273706
- Publication date Aug 27, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems for Wafer Bonding Alignment Compensation
- Publication number 20200219850
- Publication date Jul 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS FOR WAFER BONDING ALIGNMENT COMPENSATION
- Publication number 20190355698
- Publication date Nov 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and Systems for Adjusting Wafer Deformation During Wafer Bo...
- Publication number 20190355699
- Publication date Nov 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20190051524
- Publication date Feb 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- H01 - BASIC ELECTRIC ELEMENTS