Shuang-Ji Tsai

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced design for image sensing technology
- Patent number 11,923,392
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Keng-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illuminated image sensor with reduced sidewall-induced le...
- Patent number 11,901,396
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illuminated image sensor with reduced sidewall-induced le...
- Patent number 11,476,295
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for 3D image sensor
- Patent number 11,011,567
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 10,777,539
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illuminated image sensor with reduced sidewall-induced le...
- Patent number 10,566,378
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 10,535,696
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for 3D Image sensor
- Patent number 10,535,697
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 10,475,772
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 10,157,895
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method
- Patent number 10,062,728
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 9,972,603
- Issue date May 15, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside structure and methods for BSI image sensors
- Patent number 9,837,464
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- G02 - OPTICS
Information Patent Grant
Structure and method for 3D image sensor
- Patent number 9,812,487
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method
- Patent number 9,761,629
- Issue date Sep 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 9,653,508
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for low resistance image sensor contact
- Patent number 9,627,430
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside structure and methods for BSI image sensors
- Patent number 9,613,996
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside structure and methods for BSI image sensors
- Patent number 9,576,999
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illuminated image sensor having isolated bonding pads
- Patent number 9,570,497
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for 3D image sensor
- Patent number 9,525,003
- Issue date Dec 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor structure to reduce cross-talk and improve quantum eff...
- Patent number 9,455,288
- Issue date Sep 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside structure and methods for BSI image sensors
- Patent number 9,401,380
- Issue date Jul 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 9,362,329
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside structure for BSI image sensor
- Patent number 9,356,058
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside structure and method for BSI image sensors
- Patent number 9,305,966
- Issue date Apr 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Imaging sensor structure and method
- Patent number 9,287,312
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for low resistance image sensor contact
- Patent number 9,245,912
- Issue date Jan 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method
- Patent number 9,224,770
- Issue date Dec 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structures formed in double openings in dielectric layers
- Patent number 9,184,207
- Issue date Nov 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY
- Publication number 20230369366
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Keng-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE FOR CROSSTALK REDUCTION
- Publication number 20230352508
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Semiconductor Device And Method For Forming The Same
- Publication number 20220277127
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Han Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY
- Publication number 20220216260
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Keng-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Le...
- Publication number 20210143208
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Le...
- Publication number 20200144325
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for 3D Image Sensor
- Publication number 20200075659
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS
- Publication number 20200027860
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS
- Publication number 20190109121
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS
- Publication number 20180233490
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for 3D Image Sensor
- Publication number 20180061880
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Device and Method
- Publication number 20170373116
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE EXPOSED IN AN OPENING THROUGH MULTIPLE DIELECTRIC LAY...
- Publication number 20170250215
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS
- Publication number 20170186732
- Publication date Jun 29, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Structure and Methods for BSI Image Sensors
- Publication number 20170162622
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- G02 - OPTICS
Information Patent Application
Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Le...
- Publication number 20170154918
- Publication date Jun 1, 2017
- Science-Based Industrial Park
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for 3D Image Sensor
- Publication number 20170098679
- Publication date Apr 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Structure and Methods for BSI Image Sensors
- Publication number 20160336367
- Publication date Nov 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Exposed in an Opening Through Multiple Dielectric Lay...
- Publication number 20160260764
- Publication date Sep 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Structure and Methods for BSI Image Sensors
- Publication number 20160218126
- Publication date Jul 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Low Resistance Image Sensor Contact
- Publication number 20160141325
- Publication date May 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Device and Method
- Publication number 20160111464
- Publication date Apr 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR HAVING ISOLATED BONDING PADS
- Publication number 20160027836
- Publication date Jan 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for 30 Image Sensor
- Publication number 20150279893
- Publication date Oct 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Including Glue Layer and Non-Low-K Dielectric Layer i...
- Publication number 20150228690
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structures Formed in Double Openings in Dielectric Layers
- Publication number 20150194465
- Publication date Jul 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Structure and Method for BSI Image Sensors
- Publication number 20150140722
- Publication date May 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imaging Sensor Structure and Method
- Publication number 20140264683
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method
- Publication number 20140264862
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Shuang-Ji Tsai

Person

Patents Grantslast 30 patents

Enhanced design for image sensing technology

Back side illuminated image sensor with reduced sidewall-induced le...

Back side illuminated image sensor with reduced sidewall-induced le...

Structure and method for 3D image sensor

Seal-ring structure for stacking integrated circuits

Back side illuminated image sensor with reduced sidewall-induced le...

Pad structure exposed in an opening through multiple dielectric lay...

Structure and method for 3D Image sensor

Seal-ring structure for stacking integrated circuits

Seal-ring structure for stacking integrated circuits

Image sensor device and method

Seal-ring structure for stacking integrated circuits

Backside structure and methods for BSI image sensors

Structure and method for 3D image sensor

Image sensor device and method

Pad structure exposed in an opening through multiple dielectric lay...

Method and apparatus for low resistance image sensor contact

Backside structure and methods for BSI image sensors

Backside structure and methods for BSI image sensors

Back side illuminated image sensor having isolated bonding pads

Structure and method for 3D image sensor

Image sensor structure to reduce cross-talk and improve quantum eff...

Backside structure and methods for BSI image sensors

Pad structure exposed in an opening through multiple dielectric lay...

Backside structure for BSI image sensor

Backside structure and method for BSI image sensors

Imaging sensor structure and method

Method and apparatus for low resistance image sensor contact

Image sensor device and method

Pad structures formed in double openings in dielectric layers

Patents Applicationslast 30 patents

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY

IMAGE SENSOR STRUCTURE FOR CROSSTALK REDUCTION

Bonded Semiconductor Device And Method For Forming The Same

ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY

Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Le...

Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Le...

Structure and Method for 3D Image Sensor

SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS

SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS

SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS

Structure and Method for 3D Image Sensor

Image Sensor Device and Method

PAD STRUCTURE EXPOSED IN AN OPENING THROUGH MULTIPLE DIELECTRIC LAY...

SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS

Backside Structure and Methods for BSI Image Sensors

Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Le...

Structure and Method for 3D Image Sensor

Backside Structure and Methods for BSI Image Sensors

Pad Structure Exposed in an Opening Through Multiple Dielectric Lay...

Backside Structure and Methods for BSI Image Sensors

Method and Apparatus for Low Resistance Image Sensor Contact

Image Sensor Device and Method

BACK SIDE ILLUMINATED IMAGE SENSOR HAVING ISOLATED BONDING PADS

Structure and Method for 30 Image Sensor

Pad Structure Including Glue Layer and Non-Low-K Dielectric Layer i...

Pad Structures Formed in Double Openings in Dielectric Layers

Backside Structure and Method for BSI Image Sensors

Imaging Sensor Structure and Method

Interconnect Structure and Method