Shuang Wu Huang

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,304,375
- Issue date Dec 4, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,271,027
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,193,312
- Issue date Mar 20, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001143
- Publication date Jan 5, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS