Shubhada H. Sahasrabudhe

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Standoff members for semiconductor package
- Patent number 11,469,185
- Issue date Oct 11, 2022
- Intel Corporation
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flexure based cooling solutions for package stru...
- Patent number 11,276,625
- Issue date Mar 15, 2022
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computing system with a thermal interface comprising magnetic parti...
- Patent number 10,181,432
- Issue date Jan 15, 2019
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible integrated heat spreader
- Patent number 10,177,066
- Issue date Jan 8, 2019
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage controlled package and method for same
- Patent number 9,953,934
- Issue date Apr 24, 2018
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for package on package through mold interconnects
- Patent number 9,659,908
- Issue date May 23, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads for integrated circuit packages
- Patent number 9,368,461
- Issue date Jun 14, 2016
- Intel Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads for integrated circuit packages
- Patent number 9,299,672
- Issue date Mar 29, 2016
- Intel Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, system, and apparatus for gravity assisted chip attachment
- Patent number 7,411,296
- Issue date Aug 12, 2008
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING FLEXURE BASED COOLING SOLUTIONS FOR PACKAGE STRU...
- Publication number 20210280495
- Publication date Sep 9, 2021
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE
- Publication number 20200066654
- Publication date Feb 27, 2020
- Intel IP Corporation
- Je-Young CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTI...
- Publication number 20180269128
- Publication date Sep 20, 2018
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTEGRATED HEAT SPREADER
- Publication number 20180254234
- Publication date Sep 6, 2018
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE
- Publication number 20180190596
- Publication date Jul 5, 2018
- Intel Corporation
- Je-Young G. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROLLED PACKAGE AND METHOD FOR SAME
- Publication number 20170178987
- Publication date Jun 22, 2017
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS
- Publication number 20170133350
- Publication date May 11, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PADS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20150333022
- Publication date Nov 19, 2015
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method, system, and apparatus for gravity assisted chip attachment
- Publication number 20070212868
- Publication date Sep 13, 2007
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS

Shubhada H. Sahasrabudhe

Person

Patents Grantslast 30 patents

Standoff members for semiconductor package

Methods of forming flexure based cooling solutions for package stru...

Computing system with a thermal interface comprising magnetic parti...

Flexible integrated heat spreader

Warpage controlled package and method for same

Systems and methods for package on package through mold interconnects

Contact pads for integrated circuit packages

Contact pads for integrated circuit packages

Method, system, and apparatus for gravity assisted chip attachment

Patents Applicationslast 30 patents

METHODS OF FORMING FLEXURE BASED COOLING SOLUTIONS FOR PACKAGE STRU...

STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE

COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTI...

FLEXIBLE INTEGRATED HEAT SPREADER

STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE

WARPAGE CONTROLLED PACKAGE AND METHOD FOR SAME

SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS

CONTACT PADS FOR INTEGRATED CIRCUIT PACKAGES

Method, system, and apparatus for gravity assisted chip attachment