Shuen-Shin Liang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Backside contact structures with stacked metal silicide layers for...
- Patent number 12,148,807
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit isolation feature and method of forming the same
- Patent number 12,112,974
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer formation with a spin-on dielectric material
- Patent number 12,094,952
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial backside contact
- Patent number 12,080,766
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 12,068,252
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for liner-free conductive structures
- Patent number 12,057,397
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side contact structures in semiconductor devices
- Patent number 12,046,634
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures in semiconductor devices
- Patent number 12,040,372
- Issue date Jul 16, 2024
- Tawian Semiconductor Manufacturing Company, Ltd.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,002,867
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,929,327
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Inc.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer seal material for air gaps in semiconductor devices
- Patent number 11,901,220
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 11,894,437
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with high contact area
- Patent number 11,855,215
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing semiconductor devices with tunable low-k...
- Patent number 11,848,238
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,837,544
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure formed by cyclic chemical vapor deposition
- Patent number 11,823,896
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,817,384
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal material for air gaps in semiconductor devices
- Patent number 11,688,766
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer formation with a spin-on dielectric material
- Patent number 11,626,482
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial backside contact
- Patent number 11,626,494
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures
- Patent number 11,594,609
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 11,581,259
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side contact structures in semiconductor devices
- Patent number 11,563,083
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for liner-free conductive structures
- Patent number 11,521,929
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal material for air gaps in semiconductor devices
- Patent number 11,502,166
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures in semiconductor devices
- Patent number 11,489,057
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,424,185
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with high co...
- Patent number 11,393,924
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240405023
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR INSULATING FINS
- Publication number 20240379797
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379425
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20240371952
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL BACKSIDE CONTACT
- Publication number 20240363704
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL
- Publication number 20240363722
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping Layer For Liner-Free Conductive Structures
- Publication number 20240355741
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Conductive Structures
- Publication number 20240355742
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Side Contact Structures in Semiconductor Devices
- Publication number 20240339497
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures In Semiconductor Devices
- Publication number 20240332393
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu-Kai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE RELATED TO SEAMLESS METAL CONTACT
- Publication number 20240313075
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240274687
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES
- Publication number 20240162083
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE DEVICE FABRICATION METHODS AND RELATED STRUCTURES
- Publication number 20240120239
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH HIGH CONTACT AREA
- Publication number 20240105848
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
HYBRID CONDUCTIVE STRUCTURES
- Publication number 20240096998
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055491
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF
- Publication number 20240055485
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038595
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240038839
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Tsung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-Free Conductive Contact Formation
- Publication number 20240021687
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE NITRIDE FEATURE AND METHO...
- Publication number 20240006505
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...
- Publication number 20230402366
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE INTERCONNECTS
- Publication number 20230395504
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230387316
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure For Semiconductor Device
- Publication number 20230386912
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Kai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner-Free Conductive Structures With Anchor Points
- Publication number 20230387017
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONDUCTIVE LINERS OVER SILICIDE STRUCTURE...
- Publication number 20230299168
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan HU
- H01 - BASIC ELECTRIC ELEMENTS

Shuen-Shin Liang

Person

Patents Grantslast 30 patents

Backside contact structures with stacked metal silicide layers for...

Integrated circuit isolation feature and method of forming the same

Air spacer formation with a spin-on dielectric material

Epitaxial backside contact

Hybrid conductive structures

Capping layer for liner-free conductive structures

Method and structure for barrier-less plug

Dual side contact structures in semiconductor devices

Contact structures in semiconductor devices

Contact structure for semiconductor device

Self-aligned barrier for metal vias

Liner-free conductive structures with anchor points

Bilayer seal material for air gaps in semiconductor devices

Hybrid conductive structures

Semiconductor device structure with high contact area

Methods for manufacturing semiconductor devices with tunable low-k...

Liner-free conductive structures with anchor points

Conductive structure formed by cyclic chemical vapor deposition

Interconnect structure and manufacturing method for the same

Seal material for air gaps in semiconductor devices

Air spacer formation with a spin-on dielectric material

Epitaxial backside contact

Liner-free conductive structures

Hybrid conductive structures

Dual side contact structures in semiconductor devices

Capping layer for liner-free conductive structures

Seal material for air gaps in semiconductor devices

Contact structures in semiconductor devices

Semiconductor device and manufacturing method thereof

Structure and formation method of semiconductor device with high co...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

TRANSISTOR INSULATING FINS

CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

BACKSIDE CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES

EPITAXIAL BACKSIDE CONTACT

AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL

Capping Layer For Liner-Free Conductive Structures

Hybrid Conductive Structures

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

Dual Side Contact Structures in Semiconductor Devices

Contact Structures In Semiconductor Devices

METHOD AND DEVICE RELATED TO SEAMLESS METAL CONTACT

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

SELF-ALIGNED BARRIER FOR METAL VIAS

BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES

MULTI-GATE DEVICE FABRICATION METHODS AND RELATED STRUCTURES

SEMICONDUCTOR DEVICE STRUCTURE WITH HIGH CONTACT AREA

HYBRID CONDUCTIVE STRUCTURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

Void-Free Conductive Contact Formation

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE NITRIDE FEATURE AND METHO...

SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...

CONDUCTIVE STRUCTURE INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Contact Structure For Semiconductor Device

Liner-Free Conductive Structures With Anchor Points

SEMICONDUCTOR DEVICE WITH CONDUCTIVE LINERS OVER SILICIDE STRUCTURE...