Shuhang Liao

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Build-up film with low dielectric loss, preparation method therefor...
- Patent number 12,098,230
- Issue date Sep 24, 2024
- Wuhan Choice Technology Co, Ltd
- De Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid molding compound and preparation method thereof
- Patent number 12,037,488
- Issue date Jul 16, 2024
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Modification method of polyphenylene ether resin, laminated film co...
- Patent number 12,024,591
- Issue date Jul 2, 2024
- Wuhan Choice Technology Co, Ltd
- De Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Chip protective film and method for manufacturing same, and chip
- Patent number 11,978,686
- Issue date May 7, 2024
- Wuhan Choice Technology Co, Ltd
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition, adhesive film and chip packaging structure
- Patent number 11,879,076
- Issue date Jan 23, 2024
- Wuhan Choice Technology Co,Ltd
- De Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Underfill for chip packaging and chip packaging structure
- Patent number 11,804,463
- Issue date Oct 31, 2023
- Wuhan Choice Technology Co, Ltd
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive, die attach film and preparation method therefor
- Patent number 11,767,450
- Issue date Sep 26, 2023
- Wuhan Choice Technology Co, Ltd
- De Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Liquid molding compound for protecting five edges of semiconductor...
- Patent number 11,643,499
- Issue date May 9, 2023
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit build-up film for wafer-level packaging, and fabrication me...
- Patent number 11,286,386
- Issue date Mar 29, 2022
- WUHAN CHOICE TECHNOLOGY CO., LTD.
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EPOXY MOLDING COMPOUND AND PREPARATION METHOD THEREOF
- Publication number 20240425669
- Publication date Dec 26, 2024
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BUILD-UP FILM WITH LOW DIELECTRIC LOSS, PREPARATION METHOD THEREFOR...
- Publication number 20240182619
- Publication date Jun 6, 2024
- Wuhan Choice Technology Co, Ltd
- De WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION METHOD OF POLYPHENYLENE ETHER RESIN, LAMINATED FILM CO...
- Publication number 20240052098
- Publication date Feb 15, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
- Publication number 20240030075
- Publication date Jan 25, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PROTECTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND CHIP
- Publication number 20240014085
- Publication date Jan 11, 2024
- Wuhan Choice Technology Co, Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION, ADHESIVE FILM AND CHIP PACKAGING STRUCTURE
- Publication number 20240002706
- Publication date Jan 4, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH-GLOSSINESS EPOXY MOLDING COMPOUND (EMC) FILM FOR PROTECTING CH...
- Publication number 20230295415
- Publication date Sep 21, 2023
- WUHAN CHOICE TECHNOLOGY CO., LTD.
- De WU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE, DIE ATTACH FILM AND PREPARATION METHOD THEREFOR
- Publication number 20230265322
- Publication date Aug 24, 2023
- Wuhan Choice Technology Co,Ltd
- De WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNDERFILL FOR CHIP PACKAGING AND CHIP PACKAGING STRUCTURE
- Publication number 20230260948
- Publication date Aug 17, 2023
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID MOLDING COMPOUND FOR PROTECTING FIVE EDGES OF SEMICONDUCTOR...
- Publication number 20230094916
- Publication date Mar 30, 2023
- HUBEI CHOICE TECHNOLOGY CO., LTD.
- De WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Shuhang Liao

Person

Patents Grantslast 30 patents

Build-up film with low dielectric loss, preparation method therefor...

Liquid molding compound and preparation method thereof

Modification method of polyphenylene ether resin, laminated film co...

Chip protective film and method for manufacturing same, and chip

Composition, adhesive film and chip packaging structure

Underfill for chip packaging and chip packaging structure

Adhesive, die attach film and preparation method therefor

Liquid molding compound for protecting five edges of semiconductor...

Circuit build-up film for wafer-level packaging, and fabrication me...

Patents Applicationslast 30 patents

LIQUID EPOXY MOLDING COMPOUND AND PREPARATION METHOD THEREOF

BUILD-UP FILM WITH LOW DIELECTRIC LOSS, PREPARATION METHOD THEREFOR...

MODIFICATION METHOD OF POLYPHENYLENE ETHER RESIN, LAMINATED FILM CO...

DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE

CHIP PROTECTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND CHIP

COMPOSITION, ADHESIVE FILM AND CHIP PACKAGING STRUCTURE

HIGH-GLOSSINESS EPOXY MOLDING COMPOUND (EMC) FILM FOR PROTECTING CH...

ADHESIVE, DIE ATTACH FILM AND PREPARATION METHOD THEREFOR

UNDERFILL FOR CHIP PACKAGING AND CHIP PACKAGING STRUCTURE

LIQUID MOLDING COMPOUND FOR PROTECTING FIVE EDGES OF SEMICONDUCTOR...