Shuhei Yamada

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Nagaokakyo-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
MEMS device and method for producing same
- Patent number 10,934,161
- Issue date Mar 2, 2021
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package and wafer level chip size package
- Patent number 10,497,679
- Issue date Dec 3, 2019
- MURATA MANUFACTURING CO., LTD.
- Masakazu Fukumitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers
- Patent number 10,118,247
- Issue date Nov 6, 2018
- MURATA MANUFACTURING CO., LTD.
- Masakazu Fukumitsu
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20180127268
- Publication date May 10, 2018
- Murata Manufacturing Co. Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE AND WAFER LEVEL CHIP SIZE PACKAGE
- Publication number 20180096972
- Publication date Apr 5, 2018
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS
- Publication number 20170252855
- Publication date Sep 7, 2017
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL