Shuhichi Okabe

Person

Suwon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board with high-density circuit patterns
- Patent number 8,633,392
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 8,124,880
- Issue date Feb 28, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 7,971,352
- Issue date Jul 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 7,824,838
- Issue date Nov 2, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Ji-Hong Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating multilayer printed circuit board
- Patent number 7,707,715
- Issue date May 4, 2010
- Samsung Electro-Mechanics, Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board having landless via hole
- Patent number 7,516,545
- Issue date Apr 14, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS
- Publication number 20120111607
- Publication date May 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating multilayer printed circuit board
- Publication number 20100024212
- Publication date Feb 4, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20090283302
- Publication date Nov 19, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seok-Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20090151160
- Publication date Jun 18, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating multilayer printed circuit board
- Publication number 20090056119
- Publication date Mar 5, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed circuit board and manufacturing method thereof
- Publication number 20090038837
- Publication date Feb 12, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufaturing thereof
- Publication number 20080264676
- Publication date Oct 30, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20080261158
- Publication date Oct 23, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Ji-Hong Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Buried pattern substrate and manufacturing method thereof
- Publication number 20080009128
- Publication date Jan 10, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board having landless via hole
- Publication number 20070130761
- Publication date Jun 14, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shuhichi Okabe

Person

Patents Grantslast 30 patents

Circuit board with high-density circuit patterns

Circuit board and method for manufacturing thereof

Method of manufacturing printed circuit board

Method of manufacturing printed circuit board

Method of fabricating multilayer printed circuit board

Method of manufacturing printed circuit board having landless via hole

Patents Applicationslast 30 patents

CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS

Method of fabricating multilayer printed circuit board

Printed circuit board and manufacturing method thereof

Method of manufacturing printed circuit board

Method of fabricating multilayer printed circuit board

Multilayered printed circuit board and manufacturing method thereof

Circuit board and method for manufaturing thereof

Method of manufacturing printed circuit board

Buried pattern substrate and manufacturing method thereof

Method of manufacturing printed circuit board having landless via hole