Shuichi Hatakeyama

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Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Connecting terminal, semiconductor package using connecting termina...
- Patent number 8,426,742
- Issue date Apr 23, 2013
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal foil for printed wiring board and production thereof
- Patent number 5,689,879
- Issue date Nov 25, 1997
- Hitachi Chemical Company, Ltd.
- Naoyuki Urasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a printed wiring board
- Patent number 5,638,598
- Issue date Jun 17, 1997
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and production thereof
- Patent number 5,444,189
- Issue date Aug 22, 1995
- Hitachi Chemical Co., Ltd.
- Akishi Nakaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil for printed wiring board and production thereof
- Patent number 5,403,672
- Issue date Apr 4, 1995
- Hitachi Chemical Co., Ltd.
- Naoyuki Urasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE USING CONNECTING TERMINA...
- Publication number 20100071940
- Publication date Mar 25, 2010
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...