Shuichi Okuyama

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate plating method and apparatus
- Patent number 7,033,463
- Issue date Apr 25, 2006
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-plating liquid, plating method and plating apparatus
- Patent number 6,709,563
- Issue date Mar 23, 2004
- Ebara Corporation
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Substrate plating method and apparatus
- Publication number 20060144714
- Publication date Jul 6, 2006
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper-plating liquid, plating method and plating apparatus
- Publication number 20040060825
- Publication date Apr 1, 2004
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cooper-plating solution, plating method and plating apparatus
- Publication number 20040022940
- Publication date Feb 5, 2004
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless plating solution and method of forming wiring with the...
- Publication number 20030024431
- Publication date Feb 6, 2003
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper-plating liquid, plating method and plating apparatus
- Publication number 20020027081
- Publication date Mar 7, 2002
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR