Shuichi Torii

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
SiC wafer manufacturing method and SiC wafer manufacturing apparatus
- Patent number 11,945,049
- Issue date Apr 2, 2024
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus
- Patent number 10,799,987
- Issue date Oct 13, 2020
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage dividing circuit in IC structure
- Patent number 4,152,716
- Issue date May 1, 1979
- Hitachi, Ltd.
- Shuichi Torii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SiC WAFER MANUFACTURING METHOD AND SiC WAFER MANUFACTURING APPARATUS
- Publication number 20200391327
- Publication date Dec 17, 2020
- Disco Corporation
- Ryohei YAMAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20180214976
- Publication date Aug 2, 2018
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR