Shuichi Tsukada

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Mitaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of slicing a semiconductor wafer and an apparatus
- Patent number 5,458,526
- Issue date Oct 17, 1995
- Tokyo Seimitsu Co., Ltd.
- Shuichi Tsukada
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for cutting a cylindrical material
- Patent number 4,903,681
- Issue date Feb 27, 1990
- Tokyo Seimitus Co., Ltd.
- Katsuo Honda
- B28 - WORKING CEMENT, CLAY, OR STONE