TREA

Shuichiro Tsukiji

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Laser processing apparatus
    • Patent number 11,935,765
    • Issue date Mar 19, 2024
    • Disco Corporation
    • Shuichiro Tsukiji
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Processing method of wafer
    • Patent number 11,610,816
    • Issue date Mar 21, 2023
    • Disco Corporation
    • Yuki Ikku
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,456,260
    • Issue date Sep 27, 2022
    • Disco Corporation
    • Shunsuke Teranishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,417,570
    • Issue date Aug 16, 2022
    • Disco Corporation
    • Shunsuke Teranishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Non-destructive detection method
    • Patent number 10,557,704
    • Issue date Feb 11, 2020
    • Disco Corporation
    • Shuichiro Tsukiji
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,207,362
    • Issue date Feb 19, 2019
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 9,724,783
    • Issue date Aug 8, 2017
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20230409018
    • Publication date Dec 21, 2023
    • Disco Corporation
    • Koichi SHIGEMATSU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20220310419
    • Publication date Sep 29, 2022
    • Disco Corporation
    • Shuichiro Tsukiji
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210265279
    • Publication date Aug 26, 2021
    • Disco Corporation
    • Shunsuke TERANISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20210265210
    • Publication date Aug 26, 2021
    • Disco Corporation
    • Yuki IKKU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210265212
    • Publication date Aug 26, 2021
    • Disco Corporation
    • Shunsuke TERANISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NON-DESTRUCTIVE DETECTION METHOD
    • Publication number 20190242694
    • Publication date Aug 8, 2019
    • Disco Corporation
    • Shuichiro TSUKIJI
    • G01 - MEASURING TESTING
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20170014947
    • Publication date Jan 19, 2017
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20160151857
    • Publication date Jun 2, 2016
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR