Shuji Moriya

Person

Nirasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 10,312,101
- Issue date Jun 4, 2019
- Tokyo Electron Limited
- Shuji Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 9,691,630
- Issue date Jun 27, 2017
- Tokyo Electron Limited
- Nobuhiro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pipe joint
- Patent number 9,435,470
- Issue date Sep 6, 2016
- Fujikin Incorporated
- Tsuneyuki Okabe
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Pipe joint
- Patent number 9,371,946
- Issue date Jun 21, 2016
- Tokyo Electron Limited
- Tsuneyuki Okabe
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Etching apparatus and etching method
- Patent number 9,236,272
- Issue date Jan 12, 2016
- Tokyo Electron Limited
- Shuji Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 9,150,965
- Issue date Oct 6, 2015
- Tokyo Electric Limited
- Shuji Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method and non-transitory storage medium
- Patent number 9,012,331
- Issue date Apr 21, 2015
- L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Geo...
- Shuji Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow rate controller and processing apparatus
- Patent number 8,893,743
- Issue date Nov 25, 2014
- Tokyo Electron Limited
- Tsuneyuki Okabe
- G05 - CONTROLLING REGULATING
Information Patent Grant
Fluid control apparatus
- Patent number 8,434,522
- Issue date May 7, 2013
- Tokyo Electron Limited
- Wataru Okase
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Pressure type flow rate control reference and corrosion resistant p...
- Patent number 8,381,755
- Issue date Feb 26, 2013
- Fujikin Incorporated
- Shuji Moriya
- G05 - CONTROLLING REGULATING
Information Patent Grant
Thermal type mass flow meter, and thermal type mass flow control de...
- Patent number 8,219,329
- Issue date Jul 10, 2012
- Horiba Stec, Co., Ltd.
- Hiroyuki Ebi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Pressure type flow rate control reference and corrosion resistant p...
- Patent number 8,210,022
- Issue date Jul 3, 2012
- Fujikin Incorporated
- Shuji Moriya
- G05 - CONTROLLING REGULATING
Information Patent Grant
Gas supply unit and gas supply system
- Patent number 8,104,516
- Issue date Jan 31, 2012
- CKD Corporation
- Shuji Moriya
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Gas supply system for semiconductor manufacturing apparatus
- Patent number 7,862,638
- Issue date Jan 4, 2011
- Tokyo Electron Limited
- Shuji Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor fabrication system, and flow rate correction method a...
- Patent number 7,682,843
- Issue date Mar 23, 2010
- Tokyo Electron Limited
- Shuji Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma-resistant member and plasma treatment apparatus using the same
- Patent number 6,834,613
- Issue date Dec 28, 2004
- Toshiba Ceramics Co., Ltd.
- Akira Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for detecting an end point of a cleaning process
- Patent number 6,737,666
- Issue date May 18, 2004
- NEC Electronics Corporation
- Natsuko Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor-phase processing method capable of eliminating particle forma...
- Patent number 6,346,425
- Issue date Feb 12, 2002
- Tokyo Electron Limited
- Natsuko Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas supplying head and load lock chamber of semiconductor processin...
- Patent number 5,578,129
- Issue date Nov 26, 1996
- Tokyo Electron Limited
- Shuji Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process system and method
- Patent number 5,494,522
- Issue date Feb 27, 1996
- Tokyo Electron Limited
- Shuji Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing apparatus using gas
- Patent number 5,441,076
- Issue date Aug 15, 1995
- Tokyo Electron Limited
- Shuji Moriya
- G05 - CONTROLLING REGULATING
Information Patent Grant
Processing apparatus and flow control arrangement therefor
- Patent number 5,439,026
- Issue date Aug 8, 1995
- Tokyo Electron Limited
- Shuji Moriya
- G05 - CONTROLLING REGULATING
Information Patent Grant
Flow control apparatus
- Patent number 5,421,365
- Issue date Jun 6, 1995
- Tokyo Electron Limited
- Takenobu Matsuo
- G05 - CONTROLLING REGULATING
Information Patent Grant
Gas measuring device and processing apparatus provided with the gas...
- Patent number 5,294,280
- Issue date Mar 15, 1994
- Tokyo Electron Limited
- Tsuyoshi Wakabayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CLEANING CHAMBER OF SUBSTRATE PROCESSING APPARATUS
- Publication number 20180369881
- Publication date Dec 27, 2018
- TOKYO ELECTRON LIMITED
- Yukimasa SAITO
- B08 - CLEANING
Information Patent Application
SUBSTRATE CLEANING APPARATUS
- Publication number 20180355465
- Publication date Dec 13, 2018
- TOKYO ELECTRON LIMITED
- Yukimasa SAITO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20170316947
- Publication date Nov 2, 2017
- Shuji MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20160086814
- Publication date Mar 24, 2016
- TOKYO ELECTRON LIMITED
- Nobuhiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND NON-TRANSITORY STORAGE MEDIUM
- Publication number 20140357085
- Publication date Dec 4, 2014
- TOKYO ELECTRON LIMITED
- Shuji MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT
- Publication number 20140333067
- Publication date Nov 13, 2014
- FUJIKIN INCORPORATED
- Tsuneyuki Okabe
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
PIPE JOINT
- Publication number 20140312617
- Publication date Oct 23, 2014
- FUJIKIN INCORPORATED
- Tsuneyuki Okabe
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
ETCHING APPARATUS AND ETCHING METHOD
- Publication number 20140076849
- Publication date Mar 20, 2014
- TOKYO ELECTRON LIMITED
- Shuji MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW RATE CONTROLLER AND PROCESSING APPARATUS
- Publication number 20130092264
- Publication date Apr 18, 2013
- TOKYO ELECTRON LIMITED
- Tsuneyuki OKABE
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE TYPE FLOW RATE CONTROL REFERENCE AND CORROSION RESISTANT P...
- Publication number 20120234406
- Publication date Sep 20, 2012
- TOKYO ELECTRON LIMITED
- Shuji Moriya
- G05 - CONTROLLING REGULATING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20120055402
- Publication date Mar 8, 2012
- TOKYO ELECTRON LIMITED
- Shuji Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMAL TYPE MASS FLOW METER, AND THERMAL TYPE MASS FLOW CONTROL DE...
- Publication number 20110125445
- Publication date May 26, 2011
- Hiroyuki Ebi
- G05 - CONTROLLING REGULATING
Information Patent Application
FLUID CONTROL APPARATUS
- Publication number 20100096031
- Publication date Apr 22, 2010
- Tokyo Electron Limited
- Wataru Okase
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
PLASMA PROCESS APPARATUS, PLASMA PROCESS METHOD, AND OBJECT PROCESS...
- Publication number 20090246542
- Publication date Oct 1, 2009
- TOKYO ELECTRON LIMITED
- Ken Nakao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gas Supply Unit and Gas Supply System
- Publication number 20090165872
- Publication date Jul 2, 2009
- CKD CORPORATION
- Shuji Moriya
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
PRESSURE TYPE FLOW RATE CONTROL REFERENCE AND CORROSION RESISTANT P...
- Publication number 20090146089
- Publication date Jun 11, 2009
- Fujikin Incorporated
- Shuji Moriya
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR FABRICATION SYSTEM, AND FLOW RATE CORRECTION METHOD A...
- Publication number 20090061541
- Publication date Mar 5, 2009
- TOKYO ELECTRON LIMITED
- Shuji Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gas supply system and gas supply accumulation unit of semiconductor...
- Publication number 20080295963
- Publication date Dec 4, 2008
- TOKYO ELECTRON LIMITED
- Shuji Moriya
- C30 - CRYSTAL GROWTH
Information Patent Application
GAS SUPPLY SYSTEM FOR SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20080251018
- Publication date Oct 16, 2008
- TOKYO ELECTRON LIMITED
- Shuji MORIYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate Processing Device
- Publication number 20080017105
- Publication date Jan 24, 2008
- TOKYO ELECTRON LIMITED
- Shuji Moriya
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Thin-film deposition apparatus and method for rapidly switching sup...
- Publication number 20040112289
- Publication date Jun 17, 2004
- TOKYO ELECTRON LIMITED
- Shuji Moriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated fluid supply apparatus, sealing device used there, and s...
- Publication number 20020060360
- Publication date May 23, 2002
- Kazuhiko Sugiyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Shuji Moriya

Person

Patents Grantslast 30 patents

Substrate processing method and substrate processing apparatus

Etching method

Pipe joint

Pipe joint

Etching apparatus and etching method

Processing apparatus

Etching method and non-transitory storage medium

Flow rate controller and processing apparatus

Fluid control apparatus

Pressure type flow rate control reference and corrosion resistant p...

Thermal type mass flow meter, and thermal type mass flow control de...

Pressure type flow rate control reference and corrosion resistant p...

Gas supply unit and gas supply system

Gas supply system for semiconductor manufacturing apparatus

Semiconductor fabrication system, and flow rate correction method a...

Plasma-resistant member and plasma treatment apparatus using the same

Apparatus and method for detecting an end point of a cleaning process

Vapor-phase processing method capable of eliminating particle forma...

Gas supplying head and load lock chamber of semiconductor processin...

Plasma process system and method

Processing apparatus using gas

Processing apparatus and flow control arrangement therefor

Flow control apparatus

Gas measuring device and processing apparatus provided with the gas...

Patents Applicationslast 30 patents

METHOD FOR CLEANING CHAMBER OF SUBSTRATE PROCESSING APPARATUS

SUBSTRATE CLEANING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

ETCHING METHOD

ETCHING METHOD AND NON-TRANSITORY STORAGE MEDIUM

JOINT

PIPE JOINT

ETCHING APPARATUS AND ETCHING METHOD

FLOW RATE CONTROLLER AND PROCESSING APPARATUS

PRESSURE TYPE FLOW RATE CONTROL REFERENCE AND CORROSION RESISTANT P...

PROCESSING APPARATUS

THERMAL TYPE MASS FLOW METER, AND THERMAL TYPE MASS FLOW CONTROL DE...

FLUID CONTROL APPARATUS

PLASMA PROCESS APPARATUS, PLASMA PROCESS METHOD, AND OBJECT PROCESS...

Gas Supply Unit and Gas Supply System

PRESSURE TYPE FLOW RATE CONTROL REFERENCE AND CORROSION RESISTANT P...

SEMICONDUCTOR FABRICATION SYSTEM, AND FLOW RATE CORRECTION METHOD A...

Gas supply system and gas supply accumulation unit of semiconductor...

GAS SUPPLY SYSTEM FOR SEMICONDUCTOR MANUFACTURING APPARATUS

Substrate Processing Device

Thin-film deposition apparatus and method for rapidly switching sup...

Integrated fluid supply apparatus, sealing device used there, and s...