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Kobe-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic parts packaging method and electronic parts package
Patent number
7,355,126
Issue date
Apr 8, 2008
Matsushita Electric Industrial Co., Ltd.
Hidenobu Nishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for applying fluid
Patent number
6,770,320
Issue date
Aug 3, 2004
Matsushita Electric Industrial Co., Ltd.
Hiroshi Yamauchi
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Bonding head and component mounting apparatus
Patent number
6,561,408
Issue date
May 13, 2003
Matsushita Electric Industrial Co., Ltd.
Naoto Hosotani
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Electronic parts packaging method and electronic parts package
Publication number
20030092326
Publication date
May 15, 2003
Hidenobu Nishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and method for applying fluid
Publication number
20030084844
Publication date
May 8, 2003
Hiroshi Yamauchi
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
Bonding head and component mounting apparatus
Publication number
20020092887
Publication date
Jul 18, 2002
Naoto Hosotani
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR