Shuji Sagara

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 11,430,730
- Issue date Aug 30, 2022
- Dai Nippon Printing Co., Ltd.
- Yuki Aritsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting component and electronic device
- Patent number 10,672,722
- Issue date Jun 2, 2020
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting component, wiring substrate, electronic device and manufac...
- Patent number 10,276,515
- Issue date Apr 30, 2019
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20210134717
- Publication date May 6, 2021
- DAI NIPPON PRINTING CO., LTD.
- Yuki ARITSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING COMPONENT AND ELECTRONIC DEVICE
- Publication number 20190206808
- Publication date Jul 4, 2019
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING COMPONENT, WIRING SUBSTRATE, ELECTRONIC DEVICE AND MANUFAC...
- Publication number 20180240760
- Publication date Aug 23, 2018
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS