Shujie CAI

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 10,903,135
- Issue date Jan 26, 2021
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and manufacturing method
- Patent number 10,784,181
- Issue date Sep 22, 2020
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die and manufacture method thereof
- Patent number 10,607,913
- Issue date Mar 31, 2020
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING APPARATUS AND TERMINAL DEVICE
- Publication number 20220084849
- Publication date Mar 17, 2022
- Huawei Technologies Co., Ltd
- Chao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20200135615
- Publication date Apr 30, 2020
- Huawei Technologies Co., Ltd
- HuiLi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Packaging System
- Publication number 20180247880
- Publication date Aug 30, 2018
- Huawei Technologies Co., Ltd
- HuiLi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure and Manufacturing Method Thereof
- Publication number 20180190569
- Publication date Jul 5, 2018
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Manufacturing Method
- Publication number 20180190566
- Publication date Jul 5, 2018
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE AND MANUFACTURE METHOD THEREOF
- Publication number 20180068922
- Publication date Mar 8, 2018
- Huawei Technologies Co., Ltd
- HuiLi FU
- H01 - BASIC ELECTRIC ELEMENTS