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Shujiro SADANAGA
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Osaka, JP
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Patents Grants
last 30 patents
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Patent Grant
Adhesive for mounting flip chip for use in a method for producing a...
Patent number
9,748,195
Issue date
Aug 29, 2017
Sekisui Chemical Co., Ltd.
Sayaka Wakioka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device and adhesive for moun...
Patent number
9,209,155
Issue date
Dec 8, 2015
Sekisui Chemical Co., Ltd.
Sayaka Wakioka
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Adhesive for electronic components, and manufacturing method for se...
Patent number
9,011,629
Issue date
Apr 21, 2015
Sekisui Chemical Co., Ltd.
Carl Alvin Dilao
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUN...
Publication number
20160056120
Publication date
Feb 25, 2016
Sekisui Chemical Co., Ltd
Sayaka WAKIOKA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUN...
Publication number
20150064847
Publication date
Mar 5, 2015
Sekisui Chemical Co., Ltd
Sayaka Wakioka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FOR ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD FOR SE...
Publication number
20130237018
Publication date
Sep 12, 2013
Sekisui Chemical Co., Ltd
Carl Alvin Dilao
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...