Shukichi TAKII

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Ayase-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate manufacturing method
- Patent number 9,380,711
- Issue date Jun 28, 2016
- MEIKO ELECTRONICS CO., LTD.
- Shukichi Takii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating heat dissipating board
- Patent number 9,363,885
- Issue date Jun 7, 2016
- Meiko Electronics Co., Ltd.
- Noriaki Taneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing printed circuit board, and printed board produc...
- Patent number 9,185,811
- Issue date Nov 10, 2015
- MEIKO ELECTRONICS CO., LTD.
- Yoichi Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING HEAT DISSIPATING BOARD
- Publication number 20160143126
- Publication date May 19, 2016
- Meiko Electronics Co., Ltd.
- Noriaki TANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate Manufacturing Method
- Publication number 20140224762
- Publication date Aug 14, 2014
- Meiko Electronics Co., Ltd.
- Shukichi Takii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING PRINTED CIRCUIT BOARD, AND PRINTED BOARD PRODUC...
- Publication number 20130043063
- Publication date Feb 21, 2013
- Yoichi Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR