Shunichi Abe

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of attaching a semiconductor chip to a chip mounting substrate
- Patent number 7,028,397
- Issue date Apr 18, 2006
- Renesas Technology Corp.
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus utilizing a preparatory stage for a chip as...
- Patent number 6,995,468
- Issue date Feb 7, 2006
- Renesas Technology Corp.
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,965,154
- Issue date Nov 15, 2005
- Renesas Technology Corp.
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 6,867,507
- Issue date Mar 15, 2005
- Renesas Technology Corp.
- Tetsuya Uebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of fabricating the same and semiconduc...
- Patent number 6,784,021
- Issue date Aug 31, 2004
- Renesas Technology Corp.
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,737,736
- Issue date May 18, 2004
- Renesas Technology Corp.
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing system
- Patent number 6,192,146
- Issue date Feb 20, 2001
- Canon Kabushiki Kaisha
- Shunichi Abe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lead frame including frame-cutting slit for lead-on-chip (LOC) semi...
- Patent number 5,900,582
- Issue date May 4, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color image forming apparatus separately correcting each color comp...
- Patent number 5,805,314
- Issue date Sep 8, 1998
- Ricoh Company, Ltd.
- Shunichi Abe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Leadframe including frame-cutting slit for lead-on-chip (LOC) semic...
- Patent number 5,763,829
- Issue date Jun 9, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe for lead-on-chip (LOC) semiconductor device
- Patent number 5,724,726
- Issue date Mar 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method thereof
- Patent number 5,668,404
- Issue date Sep 16, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device
- Patent number 5,659,199
- Issue date Aug 19, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, junctioning method, junction material, and semicon...
- Patent number 5,609,287
- Issue date Mar 11, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Goro Izuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a lead on chip (LOC) semiconductor device
- Patent number 5,535,509
- Issue date Jul 16, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image reading and recording apparatus with correct image mode and m...
- Patent number 5,508,811
- Issue date Apr 16, 1996
- Canon Kabushiki Kaisha
- Shunichi Abe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Storing coded color components of coded input image and coded image...
- Patent number 5,471,325
- Issue date Nov 28, 1995
- Canon Kabushiki Kaisha
- Shunichi Abe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Resin-packaged semiconductor device with flow prevention dimples
- Patent number 5,440,169
- Issue date Aug 8, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, junctioning method, junction material, and semicon...
- Patent number 5,372,295
- Issue date Dec 13, 1994
- Ryoden Semiconductor System Engineering Corporation
- Shunichi Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image reproducing system having means for generating a pattern sign...
- Patent number 5,343,233
- Issue date Aug 30, 1994
- Canon Kabushiki Kaisha
- Shunichi Abe
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Low-melting-point junction material having high-melting-point parti...
- Patent number 5,317,191
- Issue date May 31, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing apparatus
- Patent number 5,204,736
- Issue date Apr 20, 1993
- Canon Kabushiki Kaisha
- Shunichi Abe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image reproducing system
- Patent number 5,191,361
- Issue date Mar 2, 1993
- Canon Kabushiki Kaisha
- Shunichi Abe
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image processing apparatus
- Patent number 5,189,523
- Issue date Feb 23, 1993
- Canon Kabushiki Kaisha
- Takashi Sugiura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Color image reading apparatus having shading correction for plural...
- Patent number 5,077,605
- Issue date Dec 31, 1991
- Canon Kabushiki Kaisha
- Yoshinori Ikeda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image reading and recording apparatus with correct image mode and m...
- Patent number 5,072,304
- Issue date Dec 10, 1991
- Canon Kabushiki Kaisha
- Shunichi Abe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Halftone image signal processing apparatus in which pixels of a dit...
- Patent number 4,987,484
- Issue date Jan 22, 1991
- Canon Kabushiki Kaisha
- Yoshinori Ikeda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Original reading apparatus applying a lamp voltage to correct lamp...
- Patent number 4,958,240
- Issue date Sep 18, 1990
- Canon Kabushiki Kaisha
- Shunichi Abe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image processing system for combining a character image with an ima...
- Patent number 4,953,012
- Issue date Aug 28, 1990
- Canon Kabushiki Kaisha
- Shunichi Abe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image reproducing system
- Patent number 4,888,636
- Issue date Dec 19, 1989
- Canon Kabushiki Kaisha
- Shunichi Abe
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA
- Publication number 20240266715
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Makoto KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
- Publication number 20240234338
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Tetsunari SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230215778
- Publication date Jul 6, 2023
- Mitsubishi Electric Corporation
- Shunichi ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a solid state image sensing device
- Publication number 20050116138
- Publication date Jun 2, 2005
- Kenji Hanada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Lead frame, semiconductor device, and method for manufacturing semi...
- Publication number 20050073031
- Publication date Apr 7, 2005
- RENESAS TECHNOLOGY CORP.
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of fabricating the same and semiconduc...
- Publication number 20040180468
- Publication date Sep 16, 2004
- Renesas Technology Corp.
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040178490
- Publication date Sep 16, 2004
- Renesas Technology Corp.
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame
- Publication number 20030062604
- Publication date Apr 3, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Uebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of producing the same and semiconducto...
- Publication number 20030059981
- Publication date Mar 27, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, and method of manufacturing the semiconductor...
- Publication number 20030054591
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of fabricating the same and semiconduc...
- Publication number 20030049915
- Publication date Mar 13, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020105061
- Publication date Aug 8, 2002
- Shunichi Abe
- H01 - BASIC ELECTRIC ELEMENTS

Shunichi Abe

Person

Patents Grantslast 30 patents

Method of attaching a semiconductor chip to a chip mounting substrate

Semiconductor apparatus utilizing a preparatory stage for a chip as...

Semiconductor device

Lead frame

Semiconductor device, method of fabricating the same and semiconduc...

Semiconductor device

Image processing system

Lead frame including frame-cutting slit for lead-on-chip (LOC) semi...

Color image forming apparatus separately correcting each color comp...

Leadframe including frame-cutting slit for lead-on-chip (LOC) semic...

Method of making leadframe for lead-on-chip (LOC) semiconductor device

Semiconductor device and production method thereof

Resin sealed semiconductor device

Solder material, junctioning method, junction material, and semicon...

Method of making a lead on chip (LOC) semiconductor device

Image reading and recording apparatus with correct image mode and m...

Storing coded color components of coded input image and coded image...

Resin-packaged semiconductor device with flow prevention dimples

Solder material, junctioning method, junction material, and semicon...

Image reproducing system having means for generating a pattern sign...

Low-melting-point junction material having high-melting-point parti...

Image processing apparatus

Image reproducing system

Image processing apparatus

Color image reading apparatus having shading correction for plural...

Image reading and recording apparatus with correct image mode and m...

Halftone image signal processing apparatus in which pixels of a dit...

Original reading apparatus applying a lamp voltage to correct lamp...

Image processing system for combining a character image with an ima...

Image reproducing system

Patents Applicationslast 30 patents

ANTENNA

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE MODULE AND METHOD FOR MANUFACTURING SAME

Method of manufacturing a solid state image sensing device

Lead frame, semiconductor device, and method for manufacturing semi...

Semiconductor device, method of fabricating the same and semiconduc...

Semiconductor device

Lead frame

Semiconductor device, method of producing the same and semiconducto...

Semiconductor device, and method of manufacturing the semiconductor...

Semiconductor device, method of fabricating the same and semiconduc...

Semiconductor device and manufacturing method thereof