Shunichi Aikawa

Person

Sannohe, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component and method of manufacturing the same
- Patent number 8,153,476
- Issue date Apr 10, 2012
- Taiyo Yuden Co., Ltd.
- Yasufumi Kaneda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device and method for manufacturing the same
- Patent number 8,154,170
- Issue date Apr 10, 2012
- Taiyo Yuden Co., Ltd.
- Masanori Kimura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 8,093,101
- Issue date Jan 10, 2012
- Taiyo Yuden Co., Ltd.
- Kaoru Sakinada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acoustic wave device with adhesive layer and method of manufacturin...
- Patent number 8,004,160
- Issue date Aug 23, 2011
- Taiyo Yuden Co., Ltd.
- Keiji Tsuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device and method of fabricating the same
- Patent number 7,911,116
- Issue date Mar 22, 2011
- Taiyo Yuden Co., Ltd.
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing a surface acoustic wave device
- Patent number 7,854,050
- Issue date Dec 21, 2010
- Taiyo Yuden Co., Ltd.
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing an acoustic wave device
- Patent number 7,841,064
- Issue date Nov 30, 2010
- Taiyo Yuden Co., Ltd.
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 7,816,794
- Issue date Oct 19, 2010
- Fujitsu Media Devices Limited
- Kaoru Sakinada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing an acoustic wave device
- Patent number 7,721,411
- Issue date May 25, 2010
- Fujitsu Media Devices Limited
- Shunichi Aikawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Acoustic wave device
- Patent number 7,586,240
- Issue date Sep 8, 2009
- Fujitsu Media Devices Limited
- Keiji Tsuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bonded substrate, surface acoustic wave chip, and surface acoustic...
- Patent number 7,208,859
- Issue date Apr 24, 2007
- Fujitsu Media Devices Limited
- Michio Miura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156265
- Publication date Jun 30, 2011
- FUJITSU MEDIA DEVICES LIMITED
- Yasufumi Kaneda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100052473
- Publication date Mar 4, 2010
- Fujitsu Media Devices Limited
- Masanori KIMURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20090236934
- Publication date Sep 24, 2009
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi AIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090212399
- Publication date Aug 27, 2009
- FUJITSU MEDIA DEVICES LIMITED
- Yasufumi Kaneda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090175470
- Publication date Jul 9, 2009
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi Aikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090160290
- Publication date Jun 25, 2009
- FUJITSU MEDIA DEVICES LIMITED
- Keiji Tsuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR
- Publication number 20090096321
- Publication date Apr 16, 2009
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20080174207
- Publication date Jul 24, 2008
- Fujitsu Media Devices Limited
- Keiji Tsuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Acoustic wave device
- Publication number 20080122314
- Publication date May 29, 2008
- Takashi Yamashita
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Acoustic wave device and method of manufacturing the same
- Publication number 20080122318
- Publication date May 29, 2008
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Acoustic wave device and method of manufacturing the same
- Publication number 20080125662
- Publication date May 29, 2008
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic device and method of fabricating the same
- Publication number 20080111247
- Publication date May 15, 2008
- FUJITSU MEDIA DEVICES LIMITED
- Kaoru Sakinada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method of fabricating the same
- Publication number 20060138672
- Publication date Jun 29, 2006
- FUJITSU MEDIA DEVICES LIMITED
- Kaoru Sakinada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Bonded substrate, surface acoustic wave chip, and surface acoustic...
- Publication number 20050194864
- Publication date Sep 8, 2005
- Michio Miura
- H03 - BASIC ELECTRONIC CIRCUITRY

Shunichi Aikawa

Person

Patents Grantslast 30 patents

Electronic component and method of manufacturing the same

Acoustic wave device and method for manufacturing the same

Electronic device and method of fabricating the same

Acoustic wave device with adhesive layer and method of manufacturin...

Surface acoustic wave device and method of fabricating the same

Method of manufacturing a surface acoustic wave device

Method of manufacturing an acoustic wave device

Electronic device and method of fabricating the same

Method of manufacturing an acoustic wave device

Acoustic wave device

Bonded substrate, surface acoustic wave chip, and surface acoustic...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR

ACOUSTIC WAVE DEVICE

Acoustic wave device

Acoustic wave device and method of manufacturing the same

Acoustic wave device and method of manufacturing the same

Electronic device and method of fabricating the same

Electronic device and method of fabricating the same

Bonded substrate, surface acoustic wave chip, and surface acoustic...