Shunichi Hayashi

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Photosensitive polyimide resin precursor composition, optical polyi...
- Patent number 7,037,637
- Issue date May 2, 2006
- Nitto Denko Corporation
- Kazunori Mune
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for manufacturing wired circuit board
- Patent number 6,889,426
- Issue date May 10, 2005
- Nitto Denko Corporation
- Hirofumi Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition and circuit board
- Patent number 6,746,816
- Issue date Jun 8, 2004
- Nitto Denko Corporation
- Shunichi Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for wiring circuit board, substrate for wiring ci...
- Patent number 6,623,843
- Issue date Sep 23, 2003
- Nitto Denko Corporation
- Hirofumi Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Negative photoresist composition
- Patent number 6,132,930
- Issue date Oct 17, 2000
- Nitto Denko Corporation
- Shunichi Hayashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Negative-working photoresist compositions and and use thereof
- Patent number 6,048,663
- Issue date Apr 11, 2000
- Nitto Denko Corporation
- Hirofumi Fujii
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of peel development
- Patent number 4,504,571
- Issue date Mar 12, 1985
- Nitto Electric Industrial Co., Ltd.
- Yutaka Yamamura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Epoxy resin compositions for sealing semiconductors
- Patent number 4,271,061
- Issue date Jun 2, 1981
- Nitto Electric Industrial Co., Ltd.
- Hideto Suzuki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Photosensitive polyimide resin precursor composition, optical polyi...
- Publication number 20040013953
- Publication date Jan 22, 2004
- NITTO DENKO CORPORATION
- Kazunori Mune
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for manufacturing flexible printed circuit and flexible prin...
- Publication number 20030064147
- Publication date Apr 3, 2003
- NITTO DENKO CORPORATION
- Hirofumi Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing wired circuit board
- Publication number 20030024110
- Publication date Feb 6, 2003
- Hirofumi Fujii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Resin composition for wiring circuit board, substrate for wiring ci...
- Publication number 20020132095
- Publication date Sep 19, 2002
- NITTO DENKO CORPORATION
- Hirofumi Fujii
- B32 - LAYERED PRODUCTS
Information Patent Application
Photosensitive resin composition and circuit board
- Publication number 20020055062
- Publication date May 9, 2002
- NITTO DENKO CORPORATION
- Shunichi Hayashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Shunichi Hayashi

Person

Patents Grantslast 30 patents

Photosensitive polyimide resin precursor composition, optical polyi...

Method for manufacturing wired circuit board

Photosensitive resin composition and circuit board

Resin composition for wiring circuit board, substrate for wiring ci...

Negative photoresist composition

Negative-working photoresist compositions and and use thereof

Method of peel development

Epoxy resin compositions for sealing semiconductors

Patents Applicationslast 30 patents

Photosensitive polyimide resin precursor composition, optical polyi...

Method for manufacturing flexible printed circuit and flexible prin...

Method for manufacturing wired circuit board

Resin composition for wiring circuit board, substrate for wiring ci...

Photosensitive resin composition and circuit board