Shunichiro Hirosawa

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Ota-Ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing workpiece
- Patent number 11,471,991
- Issue date Oct 18, 2022
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disk-shaped workpiece dividing method
- Patent number 9,586,331
- Issue date Mar 7, 2017
- Disco Corporation
- Shunichiro Hirosawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for machining wafers by cutting partway through a peripheral...
- Patent number 8,486,806
- Issue date Jul 16, 2013
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING MONOCRYSTALLINE SILICON WAFER
- Publication number 20230066601
- Publication date Mar 2, 2023
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20230050807
- Publication date Feb 16, 2023
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20220392762
- Publication date Dec 8, 2022
- Disco Corporation
- Shunichiro HIROSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WORKPIECE
- Publication number 20200230773
- Publication date Jul 23, 2020
- Disco Corporation
- Shunichiro HIROSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISK-SHAPED WORKPIECE DIVIDING METHOD
- Publication number 20140298968
- Publication date Oct 9, 2014
- Disco Corporation
- Shunichiro Hirosawa
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER MACHINING METHOD
- Publication number 20120064696
- Publication date Mar 15, 2012
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS