Shunichiro MATSUMOTO

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and semiconductor device
- Patent number 10,109,580
- Issue date Oct 23, 2018
- Shinko Electric Industries Co., Ltd.
- Shunichiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,699,912
- Issue date Jul 4, 2017
- Shinko Electric Industries Co., Ltd.
- Toyoaki Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,247,644
- Issue date Jan 26, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method of manufacturing the same, and semiconductor d...
- Patent number 8,749,073
- Issue date Jun 10, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing the same, and semiconductor...
- Patent number 8,119,927
- Issue date Feb 21, 2012
- Shinko Electric Industries Co., Ltd.
- Toshihisa Yoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for semiconductor devices
- Patent number 7,696,617
- Issue date Apr 13, 2010
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for semiconductor devices
- Patent number 7,285,856
- Issue date Oct 23, 2007
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device
- Patent number 7,196,426
- Issue date Mar 27, 2007
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device
- Patent number 7,164,198
- Issue date Jan 16, 2007
- Shinko Electric Industres, Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing multilayer circuit board for semiconductor device
- Patent number 6,988,312
- Issue date Jan 24, 2006
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device
- Patent number 6,759,739
- Issue date Jul 6, 2004
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20170179022
- Publication date Jun 22, 2017
- Shinko Electric Industries Co., Ltd.
- Shunichiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20160316560
- Publication date Oct 27, 2016
- Shinko Electric Industries Co., Ltd.
- Toyoaki SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014027
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR D...
- Publication number 20110304016
- Publication date Dec 15, 2011
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package for semiconductor devices
- Publication number 20100155114
- Publication date Jun 24, 2010
- Shinko Electronics
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package for semiconductor devices
- Publication number 20100155933
- Publication date Jun 24, 2010
- Shinko Electronics
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR...
- Publication number 20090284943
- Publication date Nov 19, 2009
- Shinko Electric Industries Co., Ltd.
- Toshihisa YODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090084585
- Publication date Apr 2, 2009
- Shinko Electric Industries Co., Ltd.
- Shunichiro Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20080265398
- Publication date Oct 30, 2008
- Shinko Electric Industries Co., Ltd.
- Shunichiro MATSUMOTO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package for semiconductor devices
- Publication number 20080042258
- Publication date Feb 21, 2008
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered substrate for semiconductor device
- Publication number 20050087860
- Publication date Apr 28, 2005
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package for semiconductor devices
- Publication number 20050006744
- Publication date Jan 13, 2005
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing multilayer circuit board for semiconductor...
- Publication number 20040074088
- Publication date Apr 22, 2004
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered substrate for semiconductor device
- Publication number 20040046244
- Publication date Mar 11, 2004
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered substrate for semiconductor device
- Publication number 20030080409
- Publication date May 1, 2003
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shunichiro MATSUMOTO

Person

Patents Grantslast 30 patents

Wiring board and semiconductor device

Wiring board

Wiring board and method for manufacturing the same

Wiring board, method of manufacturing the same, and semiconductor d...

Wiring board, method for manufacturing the same, and semiconductor...

Package for semiconductor devices

Package for semiconductor devices

Multilayered substrate for semiconductor device

Multilayered substrate for semiconductor device

Method for producing multilayer circuit board for semiconductor device

Multilayered substrate for semiconductor device

Patents Applicationslast 30 patents

WIRING BOARD AND SEMICONDUCTOR DEVICE

WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR D...

Package for semiconductor devices

Package for semiconductor devices

WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Package for semiconductor devices

Multilayered substrate for semiconductor device

Package for semiconductor devices

Method for manufacturing multilayer circuit board for semiconductor...

Multilayered substrate for semiconductor device

Multilayered substrate for semiconductor device