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Shunji Hibino
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Hirakata, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method for recycling wastes of an electrical appliance
Patent number
7,540,078
Issue date
Jun 2, 2009
Panasonic Corporation
Kenichiro Suetsugu
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Connecting material and connecting method
Patent number
7,047,635
Issue date
May 23, 2006
Matsushita Electric Industrial Co., Ltd.
Kenichiro Suetsugu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flow soldering process and apparatus
Patent number
6,805,282
Issue date
Oct 19, 2004
Matsushita Electric Industrial Co., Ltd.
Yasuji Kawashima
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of soldering using lead-free solder and bonded article prepa...
Patent number
6,702,175
Issue date
Mar 9, 2004
Matsushita Electric Industrial Co., Ltd.
Kazumi Matsushige
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connection structure and electronic circuit board
Patent number
6,657,135
Issue date
Dec 2, 2003
Matsushita Electric Industrial Co., Ltd.
Kenichiro Suetsugu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for estimating quality of lead-free solder mat...
Patent number
6,607,116
Issue date
Aug 19, 2003
Matsushita Electric Industrial Co., Ltd.
Kenichiro Suetsugu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLI...
Publication number
20080210604
Publication date
Sep 4, 2008
Matsushita Electric Industrial Co., Ltd.
Kenichiro Suetsugu
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Method of soldering lead-free solder, and joined object soldered by...
Publication number
20040144829
Publication date
Jul 29, 2004
Kazumi Matsushige
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bonded structure and electronic circuit board
Publication number
20020187689
Publication date
Dec 12, 2002
Kenichiro Suetsugu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flux applying method, flow soldering method and devices therefor an...
Publication number
20020179690
Publication date
Dec 5, 2002
Yasuji Kawashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and device for flow soldering
Publication number
20020179693
Publication date
Dec 5, 2002
Yasuji Kawashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Connecting material and connecting method
Publication number
20020022000
Publication date
Feb 21, 2002
Kenichiro Suetsugu
C01 - INORGANIC CHEMISTRY
Information
Patent Application
Method and apparatus for estimating quality of lead-free solder mat...
Publication number
20020000460
Publication date
Jan 3, 2002
Kenichiro Suetsugu
G01 - MEASURING TESTING