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Shunsaku HOSHI
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Osaka, JP
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last 30 patents
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Patent Grant
Continuous copper electroplating method
Patent number
8,801,912
Issue date
Aug 12, 2014
C. Uyemura & Co., Ltd.
Naoyuki Omura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTROLYTIC PLATING ME...
Publication number
20110089044
Publication date
Apr 21, 2011
C. Uyemura & Co., Ltd.
Toshihisa Isono
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROLYTIC PLATING EQUIPMENT AND ELECTROLYTIC PLATING METHOD
Publication number
20110056840
Publication date
Mar 10, 2011
C. Uyemura & Co., Ltd.
Toshihisa Isono
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CONTINUOUS COPPER ELECTROPLATING METHOD
Publication number
20090229986
Publication date
Sep 17, 2009
C. Uyemura & Co., Ltd.
Naoyuki OMURA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR