TREA

Shunsaku YOSHIKAWA

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Solder alloy, solder ball, solder paste, and solder joint
    • Patent number 12,109,653
    • Issue date Oct 8, 2024
    • Senju Metal Industry Co., Ltd.
    • Takahiro Matsufuji
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, solder paste, solder ball, solder preform, solder joi...
    • Patent number 12,053,843
    • Issue date Aug 6, 2024
    • Senju Metal Industry Co., Ltd.
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy and solder joint
    • Patent number 11,992,902
    • Issue date May 28, 2024
    • Senju Metal Industry Co., Ltd.
    • Takahiro Yokoyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Preform solder and method of manufacturing the same, and method of...
    • Patent number 11,772,204
    • Issue date Oct 3, 2023
    • Senju Metal Industry Co., Ltd.
    • Shunsuke Koga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 11,633,815
    • Issue date Apr 25, 2023
    • Senju Metal Industry Co., Ltd.
    • Toru Hayashida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Preform solder and method of manufacturing the same, and method of...
    • Patent number 11,628,520
    • Issue date Apr 18, 2023
    • Senju Metal Industry Co., Ltd.
    • Shunsuke Koga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, cast article, formed article, and solder joint
    • Patent number 11,607,753
    • Issue date Mar 21, 2023
    • Senju Metal Industry Co., Ltd.
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 11,577,344
    • Issue date Feb 14, 2023
    • Senju Metal Industry Co., Ltd.
    • Yuuki Iijima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, solder paste, solder ball, resin flux-cored solder an...
    • Patent number 11,241,760
    • Issue date Feb 8, 2022
    • Senju Metal Industry Co., Ltd.
    • Takahiro Yokoyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, solder ball, solder preform, solder paste and solder...
    • Patent number 11,167,379
    • Issue date Nov 9, 2021
    • Senju Metal Industry Co., Ltd.
    • Yuki Iijima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 11,123,824
    • Issue date Sep 21, 2021
    • Senju Metal Industry Co., Ltd.
    • Takahiro Yokoyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, solder paste, and solder joint
    • Patent number 10,967,464
    • Issue date Apr 6, 2021
    • Senju Metal Industry Co., Ltd.
    • Naoko Izumita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy for preventing Fe erosion, resin flux cored solder, wi...
    • Patent number 10,717,158
    • Issue date Jul 21, 2020
    • Senju Metal Industry Co., Ltd.
    • Takashi Saito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, solder ball, and solder joint
    • Patent number 10,500,680
    • Issue date Dec 10, 2019
    • Senju Metal Industry Co., Ltd.
    • Ken Tachibana
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 10,350,712
    • Issue date Jul 16, 2019
    • Senju Metal Industry Co., Ltd.
    • Motoki Koroki
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 10,343,238
    • Issue date Jul 9, 2019
    • Senju Metal Industry Co., Ltd.
    • Masayuki Suzuki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 10,213,879
    • Issue date Feb 26, 2019
    • Senju Metal Industry Co., Ltd.
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Sn-Cu-based lead-free solder alloy
    • Patent number 10,137,536
    • Issue date Nov 27, 2018
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 10,076,808
    • Issue date Sep 18, 2018
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 9,987,710
    • Issue date Jun 5, 2018
    • Senju Metal Industry Co., Ltd.
    • Motoki Koroki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 9,844,837
    • Issue date Dec 19, 2017
    • Senju Metal Industry Co., Ltd.
    • Masato Shimamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy and in-vehicle electronic circuit
    • Patent number 9,837,757
    • Issue date Dec 5, 2017
    • Senju Metal Industry Co., Ltd.
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 9,808,890
    • Issue date Nov 7, 2017
    • Senju Metal Industry Co., Ltd.
    • Hikaru Nomura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder ball
    • Patent number 9,780,055
    • Issue date Oct 3, 2017
    • Senju Metal Industry Co., Ltd.
    • Yoshie Yamanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy, connecting member and a method for its manu...
    • Patent number 9,773,721
    • Issue date Sep 26, 2017
    • Senju Metal Industry Co., Ltd.
    • Shunsaku Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 9,597,753
    • Issue date Mar 21, 2017
    • Senju Metal Industry Co., Ltd.
    • Motoki Koroki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder connection structure and solder ball
    • Patent number 8,975,757
    • Issue date Mar 10, 2015
    • Senju Metal Industry Co., Ltd.
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 8,932,519
    • Issue date Jan 13, 2015
    • Senju Metal Industry Co., Ltd.
    • Seiko Ishibashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding material for semiconductor devices
    • Patent number 8,896,119
    • Issue date Nov 25, 2014
    • Senju Metal Industry Co., Ltd.
    • Yoshitsugu Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents