Shunsuke CHISAKA

Person

Nagaokakyo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing rigid-flexible multilayer wiring board and...
- Patent number 9,949,382
- Issue date Apr 17, 2018
- Murata Manufacturing Co., Ltd.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in component and method for manufacturing the...
- Patent number 9,408,310
- Issue date Aug 2, 2016
- Murata Manufacturing Co., Ltd.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 9,204,541
- Issue date Dec 1, 2015
- MURATA MANUFACTURING CO., LTD.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing rigid-flexible multilayer wiring board and...
- Patent number 9,119,335
- Issue date Aug 25, 2015
- Murata Manufacturing Co., Ltd.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin circuit board
- Patent number 8,389,866
- Issue date Mar 5, 2013
- Murata Manufacturing Co., Ltd.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible board
- Patent number 8,287,992
- Issue date Oct 16, 2012
- Murata Manufacturing Co., Ltd.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND...
- Publication number 20150327374
- Publication date Nov 12, 2015
- Murata Manufacturing Co., Ltd.
- Shunsuke CHISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE
- Publication number 20150113802
- Publication date Apr 30, 2015
- Murata Manufacturing Co., Ltd.
- Takuya KOTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130299219
- Publication date Nov 14, 2013
- Shunsuke Chisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE...
- Publication number 20130213699
- Publication date Aug 22, 2013
- Murata Manufacturing Co., Ltd.
- Shunsuke CHISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND...
- Publication number 20120228005
- Publication date Sep 13, 2012
- Murata Manufacturing Co., Ltd.
- Shunsuke CHISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN CIRCUIT BOARD
- Publication number 20120000695
- Publication date Jan 5, 2012
- Murata Manufacturing Co., Ltd.
- Shunsuke CHISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE BOARD
- Publication number 20120003499
- Publication date Jan 5, 2012
- Murata Manufacturing Co., Ltd.
- Shunsuke CHISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING COMPONENT-EMBEDDED MODULE
- Publication number 20110100549
- Publication date May 5, 2011
- Murata Manufacturing Co., Ltd.
- Shunsuke CHISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shunsuke CHISAKA

Person

Patents Grantslast 30 patents

Method for manufacturing rigid-flexible multilayer wiring board and...

Substrate with built-in component and method for manufacturing the...

Multilayer circuit board and method for manufacturing the same

Method for manufacturing rigid-flexible multilayer wiring board and...

Resin circuit board

Flexible board

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND...

METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE...

METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND...

RESIN CIRCUIT BOARD

FLEXIBLE BOARD

METHOD FOR MANUFACTURING COMPONENT-EMBEDDED MODULE