Shunsuke FURUSE

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses and packages including a semiconductor substrate with a...
- Patent number 11,600,648
- Issue date Mar 7, 2023
- Sony Group Corporation
- Takaaki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 11,594,563
- Issue date Feb 28, 2023
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and packages including a semiconductor substrate with a...
- Patent number 11,037,975
- Issue date Jun 15, 2021
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor including grooves
- Patent number 11,024,658
- Issue date Jun 1, 2021
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 10,608,028
- Issue date Mar 31, 2020
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and electronic apparatus including a package having a micro...
- Patent number 10,332,924
- Issue date Jun 25, 2019
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaged image sensor having improved dicing properties
- Patent number 10,038,021
- Issue date Jul 31, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties, manufacturing appar...
- Patent number 9,991,301
- Issue date Jun 5, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus including an organic...
- Patent number 9,941,318
- Issue date Apr 10, 2018
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 9,728,568
- Issue date Aug 8, 2017
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
IMAGING DEVICE, METHOD OF MANUFACTURING IMAGING DEVICE, AND ELECTRO...
- Publication number 20240006448
- Publication date Jan 4, 2024
- Sony Semiconductor Solutions Corporation
- Takeya MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230178575
- Publication date Jun 8, 2023
- SONY GROUP CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230113565
- Publication date Apr 13, 2023
- Sony Semiconductor Solutions Corporation
- SHUNSUKE FURUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20210305300
- Publication date Sep 30, 2021
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210265407
- Publication date Aug 26, 2021
- SONY GROUP CORPORATION
- Takaaki HIRANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20200273897
- Publication date Aug 27, 2020
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190244996
- Publication date Aug 8, 2019
- SONY CORPORATION
- Takaaki HIRANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20180331142
- Publication date Nov 15, 2018
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20180190700
- Publication date Jul 5, 2018
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20170287964
- Publication date Oct 5, 2017
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170271389
- Publication date Sep 21, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170236860
- Publication date Aug 17, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20160027830
- Publication date Jan 28, 2016
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS

Shunsuke FURUSE

Person

Patents Grantslast 30 patents

Apparatuses and packages including a semiconductor substrate with a...

Image sensor having improved dicing properties

Apparatuses and packages including a semiconductor substrate with a...

Image sensor including grooves

Image sensor having improved dicing properties

Package and electronic apparatus including a package having a micro...

Packaged image sensor having improved dicing properties

Image sensor having improved dicing properties, manufacturing appar...

Semiconductor device and electronic apparatus including an organic...

Semiconductor device and electronic apparatus

Patents Applicationslast 30 patents

IMAGING DEVICE, METHOD OF MANUFACTURING IMAGING DEVICE, AND ELECTRO...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS