Shunsuke Mikuriya

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for polishing silicon wafer and polishing liquid therefor
- Patent number 8,932,952
- Issue date Jan 13, 2015
- Sumco Corporation
- Shinichi Ogata
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method
- Patent number 8,900,033
- Issue date Dec 2, 2014
- Sumco Corporation
- Kazushige Takaishi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing epitaxial silicon wafer
- Patent number 8,728,942
- Issue date May 20, 2014
- Sumico Corporation
- Shinichi Ogata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POLISHING SILICON WAFER AND POLISHING LIQUID THEREFOR
- Publication number 20130032573
- Publication date Feb 7, 2013
- SUMCO CORPORATION
- Shinichi Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING METHOD
- Publication number 20130017763
- Publication date Jan 17, 2013
- Kazushige Takaishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING EPITAXIAL SILICON WAFER
- Publication number 20120156878
- Publication date Jun 21, 2012
- SUMCO CORPORATION
- Shinichi Ogata
- H01 - BASIC ELECTRIC ELEMENTS