Shunsuke OTAKE

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Prober controlling device, prober controlling method, and prober
- Patent number 12,007,413
- Issue date Jun 11, 2024
- Tokyo Seimitsu Co., Ltd.
- Tetsuo Yoshida
- G01 - MEASURING TESTING
Information Patent Grant
Resin film, and laminated film including base material film, resin...
- Patent number 11,330,721
- Issue date May 10, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 11,147,166
- Issue date Oct 12, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Tomoaki Shibata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method therefor, and resin c...
- Patent number 10,674,612
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Tomoaki Shibata
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBER CONTROLLING DEVICE, PROBER CONTROLLING METHOD, AND PROBER
- Publication number 20240094254
- Publication date Mar 21, 2024
- TOKYO SEIMITSU CO., LTD.
- Tetsuo YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICO...
- Publication number 20240088051
- Publication date Mar 14, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC CORE MATERIAL, PRODUCTION METHOD FOR SAME, LAMINATE INCLUDI...
- Publication number 20230356498
- Publication date Nov 9, 2023
- Resonac Corporation
- Shunsuke OTAKE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20230331946
- Publication date Oct 19, 2023
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...
- Publication number 20200253059
- Publication date Aug 6, 2020
- Hitachi Chemical Company, Ltd.
- Tomoaki SHIBATA
- G01 - MEASURING TESTING
Information Patent Application
CURABLE COMPOSITION FOR FORMING ELASTIC RESIN LAYER
- Publication number 20190241694
- Publication date Aug 8, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...
- Publication number 20180288882
- Publication date Oct 4, 2018
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...
- Publication number 20170325336
- Publication date Nov 9, 2017
- Hitachi Chemical Company, Ltd.
- Tomoaki SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shunsuke OTAKE

Person

Patents Grantslast 30 patents

Prober controlling device, prober controlling method, and prober

Resin film, and laminated film including base material film, resin...

Method for producing semiconductor device

Semiconductor device and manufacturing method therefor, and resin c...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

PROBER CONTROLLING DEVICE, PROBER CONTROLLING METHOD, AND PROBER

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICO...

ORGANIC CORE MATERIAL, PRODUCTION METHOD FOR SAME, LAMINATE INCLUDI...

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...

CURABLE COMPOSITION FOR FORMING ELASTIC RESIN LAYER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...