Shunsuke Teranishi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 12,170,224
- Issue date Dec 17, 2024
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,854,891
- Issue date Dec 26, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,115
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,114
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,756,831
- Issue date Sep 12, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,456,260
- Issue date Sep 27, 2022
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,417,570
- Issue date Aug 16, 2022
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using a test wafer by forming modified layer using a las...
- Patent number 10,249,547
- Issue date Apr 2, 2019
- DISCO CORPORTATION
- Satoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING LAMINATED ASSEMBLY
- Publication number 20240387229
- Publication date Nov 21, 2024
- Disco Corporation
- Fumihiro INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20240234154
- Publication date Jul 11, 2024
- Disco Corporation
- Kai MINAMIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20240136193
- Publication date Apr 25, 2024
- Disco Corporation
- Kai MINAMIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20240071753
- Publication date Feb 29, 2024
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WAFER PROCESSING METHOD
- Publication number 20240006239
- Publication date Jan 4, 2024
- Disco Corporation
- Naoko YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGE DEVICE
- Publication number 20230290651
- Publication date Sep 14, 2023
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAYERED DEVICE CHIP ASSEMBLY
- Publication number 20230096486
- Publication date Mar 30, 2023
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED DEVICE WAFER FORMING METHOD
- Publication number 20230020620
- Publication date Jan 19, 2023
- Disco Corporation
- Zhiwen CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SEPARATING WAFER
- Publication number 20220371224
- Publication date Nov 24, 2022
- Disco Corporation
- Shunsuke TERANISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED DEVICE CHIP MANUFACTURING METHOD
- Publication number 20220336409
- Publication date Oct 20, 2022
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157660
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157668
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157669
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157658
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157659
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157667
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20220076999
- Publication date Mar 10, 2022
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210265279
- Publication date Aug 26, 2021
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210265212
- Publication date Aug 26, 2021
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST WAFER AND USING METHOD THEREFOR
- Publication number 20170040235
- Publication date Feb 9, 2017
- Disco Corporation
- Satoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Shunsuke Teranishi

Person

Patents Grantslast 30 patents

Wafer manufacturing method and laminated device chip manufacturing...

Method of processing wafer

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer processing method

Wafer processing method

Method for using a test wafer by forming modified layer using a las...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING LAMINATED ASSEMBLY

METHOD OF PROCESSING WAFER

METHOD OF PROCESSING WAFER

PROCESSING METHOD OF WAFER

DEVICE WAFER PROCESSING METHOD

METHOD OF MANUFACTURING PACKAGE DEVICE

METHOD OF MANUFACTURING LAYERED DEVICE CHIP ASSEMBLY

LAMINATED DEVICE WAFER FORMING METHOD

METHOD OF SEPARATING WAFER

LAMINATED DEVICE CHIP MANUFACTURING METHOD

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

METHOD OF PROCESSING WAFER

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

TEST WAFER AND USING METHOD THEREFOR