Shuo Li

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Die separation ring for wafers having a large die aspect ratio
- Patent number 12,347,733
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO
- Publication number 20230377972
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS