SHUO LIU

Person

Wuxi City, Jiangsu Province, CN

People

Patents Grantslast 30 patents

Information Patent Grant
SIP package structure
- Patent number 12,249,582
- Issue date Mar 11, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method for manufacturing the same
- Patent number 12,148,681
- Issue date Nov 19, 2024
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package structure
- Patent number 12,074,116
- Issue date Aug 27, 2024
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-substrate antenna package structure and method for manufacturi...
- Patent number 11,978,694
- Issue date May 7, 2024
- JCET GROUP CO., LTD.
- Shuo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having a plurality of chips attached to a lead fr...
- Patent number 11,854,949
- Issue date Dec 26, 2023
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240413042
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Shuo LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240312861
- Publication date Sep 19, 2024
- JCET Group Co. Ltd.
- Chen XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128142
- Publication date Apr 18, 2024
- JCET GROUP CO., LTD.
- Shuo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411826
- Publication date Dec 21, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335882
- Publication date Oct 19, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282599
- Publication date Sep 7, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187366
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187363
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187422
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230005811
- Publication date Jan 5, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220399254
- Publication date Dec 15, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SUBSTRATE ANTENNA PACKAGE STRUCTURE AND METHOD FOR MANUFACTURI...
- Publication number 20220392831
- Publication date Dec 8, 2022
- JCET GROUP CO., LTD.
- SHUO LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE STRUCTURE
- Publication number 20220223541
- Publication date Jul 14, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP PACKAGE STRUCTURE
- Publication number 20220223539
- Publication date Jul 14, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGE METHOD FOR CAVITY DEVICE GROUP
- Publication number 20220223574
- Publication date Jul 14, 2022
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

SIP package structure

Fan-out package structure and method for manufacturing the same

Integrated package structure

Dual-substrate antenna package structure and method for manufacturi...

Package structure having a plurality of chips attached to a lead fr...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

THREE-DIMENSIONAL PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

DUAL-SUBSTRATE ANTENNA PACKAGE STRUCTURE AND METHOD FOR MANUFACTURI...

INTEGRATED PACKAGE STRUCTURE

SIP PACKAGE STRUCTURE

PACKAGE STRUCTURE AND PACKAGE METHOD FOR CAVITY DEVICE GROUP