Shutesh Krishnan

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding module pins to an electronic substrate
- Patent number 12,160,060
- Issue date Dec 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package for notched semiconductor die
- Patent number 11,942,369
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 11,776,870
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ultra-thin multichip power devices
- Patent number 11,721,654
- Issue date Aug 8, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nurul Nadiah Manap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding module pins to an electronic substrate
- Patent number 11,626,677
- Issue date Apr 11, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin multichip power devices
- Patent number 10,930,604
- Issue date Feb 23, 2021
- Semiconductor Components Industries, LLC
- Nurul Nadiah Manap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,763,173
- Issue date Sep 1, 2020
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,319,639
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method
- Patent number 9,997,485
- Issue date Jun 12, 2018
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method
- Patent number 9,780,059
- Issue date Oct 3, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a packaging substrate having a trench
- Patent number 8,519,521
- Issue date Aug 27, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 8,451,621
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method of manufacture
- Patent number 8,449,339
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of forming an electronic device including removing a conduc...
- Patent number 8,268,676
- Issue date Sep 18, 2012
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component with a low cost l...
- Patent number 7,939,380
- Issue date May 10, 2011
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacture
- Patent number 7,402,895
- Issue date Jul 22, 2008
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240072009
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL
- Publication number 20240030208
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20240006266
- Publication date Jan 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
- Publication number 20230246364
- Publication date Aug 3, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
- Publication number 20210359445
- Publication date Nov 18, 2021
- Semiconductor Components Industries, LLC
- Erik Nino Mercado TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20210225730
- Publication date Jul 22, 2021
- Semiconductor Components Industries, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ULTRA-THIN MULTICHIP POWER DEVICES
- Publication number 20210183799
- Publication date Jun 17, 2021
- Semiconductor Components Industries, LLC
- Nurul Nadiah MANAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200357697
- Publication date Nov 12, 2020
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Related Methods
- Publication number 20200286865
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN MULTICHIP POWER DEVICES
- Publication number 20190304940
- Publication date Oct 3, 2019
- Semiconductor Components Industries, LLC
- Nurul Nadiah MANAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190252255
- Publication date Aug 15, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057900
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20170352635
- Publication date Dec 7, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH
- Publication number 20120306066
- Publication date Dec 6, 2012
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE
- Publication number 20120064781
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20120063107
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20120018864
- Publication date Jan 26, 2012
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH
- Publication number 20110115061
- Publication date May 19, 2011
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
- Publication number 20090102028
- Publication date Apr 23, 2009
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure and method of manufacture
- Publication number 20070138610
- Publication date Jun 21, 2007
- Semiconductor Components Industries, LLC.
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS

Shutesh Krishnan

Person

Patents Grantslast 30 patents

Direct bonded copper substrates fabricated using silver sintering

Bonding module pins to an electronic substrate

Thin semiconductor package for notched semiconductor die

Semiconductor package and related methods

Direct bonded copper substrates fabricated using silver sintering

Ultra-thin multichip power devices

Bonding module pins to an electronic substrate

Ultra-thin multichip power devices

Thin semiconductor package and related methods

Thin semiconductor package and related methods

Bonding structure and method

Bonding structure and method

Electronic device including a packaging substrate having a trench

Semiconductor component and method of manufacture

Connector assembly and method of manufacture

Process of forming an electronic device including removing a conduc...

Method of manufacturing a semiconductor component with a low cost l...

Semiconductor package structure and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND RELATED METHODS

HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE

BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

ULTRA-THIN MULTICHIP POWER DEVICES

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

Semiconductor Package and Related Methods

ULTRA-THIN MULTICHIP POWER DEVICES

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

BONDING STRUCTURE AND METHOD

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

BONDING STRUCTURE AND METHOD

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...

Semiconductor package structure and method of manufacture