Shuuji Suzuki

Person

Nagahama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal substrate and light source device
- Patent number 8,742,432
- Issue date Jun 3, 2014
- Mitsubishi Chemical Corporation
- Yoshihito Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal laminated body, LED-mounted substrate, and white film
- Patent number 8,169,129
- Issue date May 1, 2012
- Mitsubishi Plastics, Inc.
- Jun Matsui
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 7,334,324
- Issue date Feb 26, 2008
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device integrated multilayer wiring board
- Patent number 7,022,399
- Issue date Apr 4, 2006
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, semiconductor device mounting board using...
- Patent number 6,797,367
- Issue date Sep 28, 2004
- Sony Corporation
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL SUBSTRATE AND LIGHT SOURCE DEVICE
- Publication number 20120138990
- Publication date Jun 7, 2012
- MITSUBISHI CHEMICAL CORPORATION
- Yoshihito SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LAMINATED BODY, LED-MOUNTED SUBSTRATE, AND WHITE FILM
- Publication number 20100301725
- Publication date Dec 2, 2010
- Jun Matsui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of Manufacturing Multilayer Wiring Board
- Publication number 20080116611
- Publication date May 22, 2008
- Sony Corporation
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer wiring board, semiconductor device mounting board using...
- Publication number 20050025944
- Publication date Feb 3, 2005
- Sony Corporation
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer wiring board, semiconductor device mounting board using...
- Publication number 20030180510
- Publication date Sep 25, 2003
- Minoru Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device built-in multilayer wiring board and method of...
- Publication number 20030178726
- Publication date Sep 25, 2003
- Minoru Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shuuji Suzuki

Person

Patents Grantslast 30 patents

Metal substrate and light source device

Metal laminated body, LED-mounted substrate, and white film

Method of manufacturing multilayer wiring board

Semiconductor device integrated multilayer wiring board

Multilayer wiring board, semiconductor device mounting board using...

Patents Applicationslast 30 patents

METAL SUBSTRATE AND LIGHT SOURCE DEVICE

METAL LAMINATED BODY, LED-MOUNTED SUBSTRATE, AND WHITE FILM

Method of Manufacturing Multilayer Wiring Board

Multilayer wiring board, semiconductor device mounting board using...

Multilayer wiring board, semiconductor device mounting board using...

Semiconductor device built-in multilayer wiring board and method of...