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Shuzo HIRATA
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Wiring substrate
Patent number
8,222,536
Issue date
Jul 17, 2012
Fujikara Ltd.
Shuzo Hirata
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
WIRING SUBSTRATE
Publication number
20090139748
Publication date
Jun 4, 2009
FUJIKURA LTD.
Shuzo HIRATA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR