Shwin-Chung Wong

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Vapor chamber device
- Patent number 11,644,250
- Issue date May 9, 2023
- National Tsing Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 11,512,910
- Issue date Nov 29, 2022
- National Tsing Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Quick detachable thermal connector
- Patent number 9,681,584
- Issue date Jun 13, 2017
- National Tsing Hua University
- Shwin-Chung Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling of integrated LED lights and micro camera for minimally inv...
- Patent number 9,591,193
- Issue date Mar 7, 2017
- National Tsing Hua University
- Shwin-Chung Wong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat dissipation devices for an LED lamp set
- Patent number 7,637,633
- Issue date Dec 29, 2009
- National Tsing Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flat-plate heat pipe containing channels
- Patent number 7,392,836
- Issue date Jul 1, 2008
- National Tsing Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microchannel flat-plate heat pipe with parallel grooves for recycli...
- Patent number 7,234,513
- Issue date Jun 26, 2007
- National Tsing Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microchannel heat pipe with parallel grooves for recycling coolant
- Patent number 7,011,146
- Issue date Mar 14, 2006
- NationalTsing Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20250159841
- Publication date May 15, 2025
- National Tsing-Hua University
- Shwin-Chung Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER DEVICE
- Publication number 20240344773
- Publication date Oct 17, 2024
- National Tsing-Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER SYSTEM
- Publication number 20240302108
- Publication date Sep 12, 2024
- National Tsing-Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER DEVICE
- Publication number 20230144108
- Publication date May 11, 2023
- National Tsing-Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20220128322
- Publication date Apr 28, 2022
- National Tsing-Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER DEVICE
- Publication number 20210180877
- Publication date Jun 17, 2021
- National Tsing-Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Quick Detachable Thermal Connector
- Publication number 20160242322
- Publication date Aug 18, 2016
- National Tsing-Hua University
- Shwin-Chung Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING OF INTEGRATED LED LIGHTS AND MICRO CAMERA FOR MINIMALLY INV...
- Publication number 20150316245
- Publication date Nov 5, 2015
- National Tsing Hua University
- Shwin-Chung WONG
- F21 - LIGHTING
Information Patent Application
HEAT DISSPATION STRUCTURE OF ELECTRONIC APPARATUS
- Publication number 20110110041
- Publication date May 12, 2011
- Shwin-Chung WONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED LAMP
- Publication number 20110044043
- Publication date Feb 24, 2011
- Shwin-Chung WONG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WATER-COOLING MODULE FOR LED HEADLAMP
- Publication number 20100321950
- Publication date Dec 23, 2010
- Shwin-Chung WONG
- F21 - LIGHTING
Information Patent Application
Heat dissipation devices for and LED lamp set
- Publication number 20070086196
- Publication date Apr 19, 2007
- National Tsing Hua University
- Shwin-Chung WONG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Flat-plate heat pipe containing channels
- Publication number 20070056714
- Publication date Mar 15, 2007
- National Tsing Hua University
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Microchannel flat-plate heat pipe with parallel grooves for recycli...
- Publication number 20050183847
- Publication date Aug 25, 2005
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Transport line with grooved microchannels for two-phase heat dissip...
- Publication number 20050077030
- Publication date Apr 14, 2005
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Microchannel heat pipe with parallel grooves for recycling coolant
- Publication number 20040196633
- Publication date Oct 7, 2004
- Shwin-Chung Wong
- F28 - HEAT EXCHANGE IN GENERAL

Shwin-Chung Wong

Person

Patents Grantslast 30 patents

Vapor chamber device

Heat dissipation device

Quick detachable thermal connector

Cooling of integrated LED lights and micro camera for minimally inv...

Heat dissipation devices for an LED lamp set

Flat-plate heat pipe containing channels

Microchannel flat-plate heat pipe with parallel grooves for recycli...

Microchannel heat pipe with parallel grooves for recycling coolant

Patents Applicationslast 30 patents

HEAT DISSIPATION DEVICE

VAPOR CHAMBER DEVICE

VAPOR CHAMBER SYSTEM

VAPOR CHAMBER DEVICE

HEAT DISSIPATION DEVICE

VAPOR CHAMBER DEVICE

Quick Detachable Thermal Connector

COOLING OF INTEGRATED LED LIGHTS AND MICRO CAMERA FOR MINIMALLY INV...

HEAT DISSPATION STRUCTURE OF ELECTRONIC APPARATUS

LED LAMP

WATER-COOLING MODULE FOR LED HEADLAMP

Heat dissipation devices for and LED lamp set

Flat-plate heat pipe containing channels

Microchannel flat-plate heat pipe with parallel grooves for recycli...

Transport line with grooved microchannels for two-phase heat dissip...

Microchannel heat pipe with parallel grooves for recycling coolant