Shyam Ramalingam

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 11,011,420
- Issue date May 18, 2021
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect assemblies with through-silicon vias and stress-relief...
- Patent number 10,847,442
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 10,546,777
- Issue date Jan 28, 2020
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping poly channel pillars in stacked circuits
- Patent number 10,319,678
- Issue date Jun 11, 2019
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 9,922,875
- Issue date Mar 20, 2018
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions and methods of forming intersecting lin...
- Patent number 9,911,643
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 9,754,825
- Issue date Sep 5, 2017
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal cap in a semiconductor memory device
- Patent number 9,577,192
- Issue date Feb 21, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions
- Patent number 9,391,001
- Issue date Jul 12, 2016
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping poly channel pillars in stacked circuits
- Patent number 9,263,459
- Issue date Feb 16, 2016
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 9,099,442
- Issue date Aug 4, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20200235007
- Publication date Jul 23, 2020
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20180174902
- Publication date Jun 21, 2018
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20170316974
- Publication date Nov 2, 2017
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE
- Publication number 20170133585
- Publication date May 11, 2017
- Sony Semiconductor Solutions Corporation
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions and Methods of Forming Intersecting Lin...
- Publication number 20160293482
- Publication date Oct 6, 2016
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING POLY CHANNEL PILLARS IN STACKED CIRCUITS
- Publication number 20160247756
- Publication date Aug 25, 2016
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20150340282
- Publication date Nov 26, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE
- Publication number 20150340247
- Publication date Nov 26, 2015
- SONY CORPORATION
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES WITH THROUGH-SILICON VIAS AND STRESS-RELIEF...
- Publication number 20150243583
- Publication date Aug 27, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions
- Publication number 20150054164
- Publication date Feb 26, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20150035150
- Publication date Feb 5, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS

Shyam Ramalingam

Person

Patents Grantslast 30 patents

Conductive interconnect structures incorporating negative thermal e...

Interconnect assemblies with through-silicon vias and stress-relief...

Conductive interconnect structures incorporating negative thermal e...

Capping poly channel pillars in stacked circuits

Conductive interconnect structures incorporating negative thermal e...

Semiconductor constructions and methods of forming intersecting lin...

Conductive interconnect structures incorporating negative thermal e...

Method for forming a metal cap in a semiconductor memory device

Semiconductor constructions

Capping poly channel pillars in stacked circuits

Conductive interconnect structures incorporating negative thermal e...

Patents Applicationslast 30 patents

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...

METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE

Semiconductor Constructions and Methods of Forming Intersecting Lin...

CAPPING POLY CHANNEL PILLARS IN STACKED CIRCUITS

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...

METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE

INTERCONNECT ASSEMBLIES WITH THROUGH-SILICON VIAS AND STRESS-RELIEF...

Semiconductor Constructions

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...