Shyh-Fann Ting

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,996,433
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical gate field effect transistor
- Patent number 11,948,949
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced design for image sensing technology
- Patent number 11,923,392
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Keng-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising polysilicon gate electrode and nitride hard...
- Patent number 11,837,622
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 11,728,366
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal reflector grounding for noise reduction in light detector
- Patent number 11,705,474
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved full well capacity and related method...
- Patent number 11,545,513
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming image sensor
- Patent number 11,444,116
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor image sensor device having d...
- Patent number 11,430,823
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical gate field effect transistor
- Patent number 11,404,460
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,322,540
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 11,227,889
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,222,915
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal reflector grounding for noise reduction in light detector
- Patent number 11,088,196
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved full well capacity and related method...
- Patent number 11,069,733
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved full well capacity and related method...
- Patent number 10,971,534
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising reflective guide layer and method of formin...
- Patent number 10,943,940
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 10,879,305
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated image sensor with negatively charged layer
- Patent number 10,868,050
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shyh-Fann Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 10,833,119
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device with deep trench isolations and m...
- Patent number 10,825,853
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming image sensor device structure with doping layer...
- Patent number 10,777,590
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved full well capacity and related method...
- Patent number 10,658,410
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 10,510,789
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device structure with doping layer in light-sensing re...
- Patent number 10,475,828
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 10,276,618
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with reduced optical path
- Patent number 10,269,858
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Shyh-Fann Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising reflective guide layer and method of formin...
- Patent number 10,269,857
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming polysilicon gate structure in image sensor device
- Patent number 10,204,960
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side illuminated (BSI) image sensor with global shutter scheme
- Patent number 10,147,752
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD STRUCTURE WITH HIGH VIA DENSITY
- Publication number 20240387591
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...
- Publication number 20240379711
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA LANDING ON FRONT END OF LINE STRUCTURE
- Publication number 20240379500
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CAPACITOR FOR IMAGE SENSOR PIXEL CIRCUITRY
- Publication number 20240355865
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ping Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BACK SIDE DEEP TRENCH ISOLATON STRUCTURE WITH SUB...
- Publication number 20240243156
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL GATE FIELD EFFECT TRANSISTOR
- Publication number 20240204016
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY
- Publication number 20240194716
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY
- Publication number 20230369366
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Keng-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor with Extension Pad
- Publication number 20230369380
- Publication date Nov 16, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Y.C. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
- Publication number 20230335572
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE
- Publication number 20230317757
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING AN IMPROVED STRUCTURE FOR SMALL PIXEL DESIGNS
- Publication number 20230307479
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415935
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-HAN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20220384514
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE WITH HIGH VIA DENSITY
- Publication number 20220367554
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL GATE FIELD EFFECT TRANSISTOR
- Publication number 20220352223
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220352218
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-TING CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Semiconductor Device And Method For Forming The Same
- Publication number 20220277127
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Han Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20220254828
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...
- Publication number 20220223635
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY
- Publication number 20220216260
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Keng-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
- Publication number 20220059583
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL REFLECTOR GROUNDING FOR NOISE REDUCTION IN LIGHT DETECTOR
- Publication number 20210313383
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL GATE FIELD EFFECT TRANSISTOR
- Publication number 20210210534
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED FULL WELL CAPACITY AND RELATED METHOD...
- Publication number 20210183921
- Publication date Jun 17, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL REFLECTOR GROUNDING FOR NOISE REDUCTION IN LIGHT DETECTOR
- Publication number 20210151495
- Publication date May 20, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING IMAGE SENSOR
- Publication number 20210118939
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR IMAGE SENSOR DEVICE
- Publication number 20210043664
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-TING CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20210028219
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED FULL WELL CAPACITY AND RELATED METHOD...
- Publication number 20200212083
- Publication date Jul 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Shyh-Fann Ting

Person

Patents Grantslast 30 patents

Pad structure for front side illuminated image sensor

Vertical gate field effect transistor

Enhanced design for image sensing technology

Image sensor comprising polysilicon gate electrode and nitride hard...

Extra doped region for back-side deep trench isolation

Metal reflector grounding for noise reduction in light detector

Image sensor having improved full well capacity and related method...

Method for forming image sensor

Method for manufacturing semiconductor image sensor device having d...

Vertical gate field effect transistor

Pad structure for front side illuminated image sensor

Extra doped region for back-side deep trench isolation

Pad structure for front side illuminated image sensor

Metal reflector grounding for noise reduction in light detector

Image sensor having improved full well capacity and related method...

Image sensor having improved full well capacity and related method...

Image sensor comprising reflective guide layer and method of formin...

Image sensor

Backside illuminated image sensor with negatively charged layer

Pad structure for front side illuminated image sensor

Semiconductor image sensor device with deep trench isolations and m...

Method for forming image sensor device structure with doping layer...

Image sensor having improved full well capacity and related method...

Extra doped region for back-side deep trench isolation

Image sensor device structure with doping layer in light-sensing re...

Extra doped region for back-side deep trench isolation

Image sensor with reduced optical path

Image sensor comprising reflective guide layer and method of formin...

Method of forming polysilicon gate structure in image sensor device

Back-side illuminated (BSI) image sensor with global shutter scheme

Patents Applicationslast 30 patents

BOND PAD STRUCTURE WITH HIGH VIA DENSITY

SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...

THROUGH SUBSTRATE VIA LANDING ON FRONT END OF LINE STRUCTURE

SEMICONDUCTOR CAPACITOR FOR IMAGE SENSOR PIXEL CIRCUITRY

HIGH ASPECT RATIO BACK SIDE DEEP TRENCH ISOLATON STRUCTURE WITH SUB...

VERTICAL GATE FIELD EFFECT TRANSISTOR

TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY

ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY

Image Sensor with Extension Pad

EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION

ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE

IMAGE SENSOR HAVING AN IMPROVED STRUCTURE FOR SMALL PIXEL DESIGNS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR

BOND PAD STRUCTURE WITH HIGH VIA DENSITY

VERTICAL GATE FIELD EFFECT TRANSISTOR

SEMICONDUCTOR STRUCTURE

Bonded Semiconductor Device And Method For Forming The Same

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...

ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY

EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION

METAL REFLECTOR GROUNDING FOR NOISE REDUCTION IN LIGHT DETECTOR

VERTICAL GATE FIELD EFFECT TRANSISTOR

IMAGE SENSOR HAVING IMPROVED FULL WELL CAPACITY AND RELATED METHOD...

METAL REFLECTOR GROUNDING FOR NOISE REDUCTION IN LIGHT DETECTOR

METHOD FOR FORMING IMAGE SENSOR

METHOD FOR MANUFACTURING SEMICONDUCTOR IMAGE SENSOR DEVICE

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

IMAGE SENSOR HAVING IMPROVED FULL WELL CAPACITY AND RELATED METHOD...