Shyh-Jen Guo

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure
- Patent number 8,796,824
- Issue date Aug 5, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and process of manufacturing the same
- Patent number 8,437,142
- Issue date May 7, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure and process of manufacturing the same
- Patent number 8,330,280
- Issue date Dec 11, 2012
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF
- Publication number 20250071895
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Chih-Hsiung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME
- Publication number 20120318570
- Publication date Dec 20, 2012
- Cheng-Hung Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME
- Publication number 20120319271
- Publication date Dec 20, 2012
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS