Shyi-Ching Liau

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-to-wafer stack with supporting post
- Patent number 9,111,774
- Issue date Aug 18, 2015
- Industrial Technology Research Institute
- Chi-Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-to-wafer stack with supporting pedestal
- Patent number 8,810,031
- Issue date Aug 19, 2014
- Industrial Technology Research Institute
- Chi-Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-pipe electric-power generating device
- Patent number 8,283,613
- Issue date Oct 9, 2012
- Industrial Technology Research Institute
- Ra-Min Tain
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
LED lamp
- Patent number RE43626
- Issue date Sep 4, 2012
- Transpacific IP I Ltd.
- Ra-Min Tain
- 362 - Illumination
Information Patent Grant
Wafer-to-wafer stack with supporting pedestal
- Patent number 8,164,165
- Issue date Apr 24, 2012
- Industrial Technology Research Institute
- Chi-Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with stress buffering ability and the manufa...
- Patent number 8,123,965
- Issue date Feb 28, 2012
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure of an integrated circuit and manufacturing m...
- Patent number 8,026,603
- Issue date Sep 27, 2011
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-to-wafer stacking
- Patent number 7,948,072
- Issue date May 24, 2011
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for reducing stress for vias and fabricating method thereof
- Patent number 7,754,599
- Issue date Jul 13, 2010
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure with stress buffering ability and the manufa...
- Patent number 7,586,187
- Issue date Sep 8, 2009
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for reducing stress for vias and fabricating method thereof
- Patent number 7,545,039
- Issue date Jun 9, 2009
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting devices
- Patent number 7,517,114
- Issue date Apr 14, 2009
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Grant
Lighting device with flipped side-structure of LEDs
- Patent number 7,381,995
- Issue date Jun 3, 2008
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Grant
Side structure of a bare LED and backlight module thereof
- Patent number 7,375,384
- Issue date May 20, 2008
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of illuminating unit and structure of illuminating light...
- Patent number 7,354,178
- Issue date Apr 8, 2008
- Industrial Technology Research Institute
- Wei-Kuo Han
- F21 - LIGHTING
Information Patent Grant
LED lamp
- Patent number 7,314,291
- Issue date Jan 1, 2008
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Grant
Side structure of a bare LED and backlight module thereof
- Patent number 7,312,478
- Issue date Dec 25, 2007
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a stacked chip on a leadframe
- Patent number 6,307,256
- Issue date Oct 23, 2001
- Apack Technologies Inc.
- Cheng-Lien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing device and method for known good chip
- Patent number 6,259,266
- Issue date Jul 10, 2001
- Apack Technologies Inc.
- Cheng-Lien Chiang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER-TO-WAFER STACK WITH SUPPORTING POST
- Publication number 20130161829
- Publication date Jun 27, 2013
- Industrial Technology Research Institute
- Chi-Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL
- Publication number 20120178212
- Publication date Jul 12, 2012
- Industrial Technology Research Institute
- Chi-Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL
- Publication number 20110156249
- Publication date Jun 30, 2011
- Industrial Technology Research Institute
- Chi-Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-To-Wafer Stacking
- Publication number 20100020502
- Publication date Jan 28, 2010
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for reducing stress for vias and fabricating method thereof
- Publication number 20090156001
- Publication date Jun 18, 2009
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE WITH STRESS BUFFERING ABILITY AND THE MANUFA...
- Publication number 20080264899
- Publication date Oct 30, 2008
- Yung-Yu HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTING DEVICES
- Publication number 20080013320
- Publication date Jan 17, 2008
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Application
LED LAMP
- Publication number 20070297178
- Publication date Dec 27, 2007
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Application
Interconnect structure with stress buffering ability and the manufa...
- Publication number 20070228549
- Publication date Oct 4, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Side structure of a bare LED and backlight module thereof
- Publication number 20070205427
- Publication date Sep 6, 2007
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-PIPE ELECTRIC-POWER GENERATING DEVICE
- Publication number 20070151969
- Publication date Jul 5, 2007
- Industrial Technology Research Institute
- Ra-Min Tain
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Application
Interconnect structure of an integrated circuit and manufacturing m...
- Publication number 20070128845
- Publication date Jun 7, 2007
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure for reducing stress for vias and fabricating method thereof
- Publication number 20070108572
- Publication date May 17, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer-to-wafer stack with supporting pedestal
- Publication number 20070090490
- Publication date Apr 26, 2007
- Industrial Technology Research Institute
- Chi-Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structur of illuminating unit and structure of illuminating light s...
- Publication number 20070019412
- Publication date Jan 25, 2007
- Wei-Kuo Han
- F21 - LIGHTING
Information Patent Application
Lighting device with flipped side-structure of LEDs
- Publication number 20060220030
- Publication date Oct 5, 2006
- Ra-Min Tain
- F21 - LIGHTING
Information Patent Application
Side structure of a bare LED and backlight module thereof
- Publication number 20060027827
- Publication date Feb 9, 2006
- Industrial Technology Research Institute
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED lamp
- Publication number 20060001384
- Publication date Jan 5, 2006
- Industrial Technology Research Institute
- Ra-Min Tain
- F21 - LIGHTING

Shyi-Ching Liau

Person

Patents Grantslast 30 patents

Wafer-to-wafer stack with supporting post

Wafer-to-wafer stack with supporting pedestal

Heat-pipe electric-power generating device

LED lamp

Wafer-to-wafer stack with supporting pedestal

Interconnect structure with stress buffering ability and the manufa...

Interconnect structure of an integrated circuit and manufacturing m...

Wafer-to-wafer stacking

Structure for reducing stress for vias and fabricating method thereof

Interconnect structure with stress buffering ability and the manufa...

Structure for reducing stress for vias and fabricating method thereof

Lighting devices

Lighting device with flipped side-structure of LEDs

Side structure of a bare LED and backlight module thereof

Structure of illuminating unit and structure of illuminating light...

LED lamp

Side structure of a bare LED and backlight module thereof

Semiconductor package with a stacked chip on a leadframe

Testing device and method for known good chip

Patents Applicationslast 30 patents

WAFER-TO-WAFER STACK WITH SUPPORTING POST

WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL

WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL

Wafer-To-Wafer Stacking

Structure for reducing stress for vias and fabricating method thereof

INTERCONNECT STRUCTURE WITH STRESS BUFFERING ABILITY AND THE MANUFA...

LIGHTING DEVICES

LED LAMP

Interconnect structure with stress buffering ability and the manufa...

Side structure of a bare LED and backlight module thereof

HEAT-PIPE ELECTRIC-POWER GENERATING DEVICE

Interconnect structure of an integrated circuit and manufacturing m...

Structure for reducing stress for vias and fabricating method thereof

Wafer-to-wafer stack with supporting pedestal

Structur of illuminating unit and structure of illuminating light s...

Lighting device with flipped side-structure of LEDs

Side structure of a bare LED and backlight module thereof

LED lamp