Shyng-Tsong Chen

Person

Rensselaer, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures including self aligned vias
- Patent number 11,735,468
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect integration scheme with fully self-aligned vias
- Patent number 11,264,276
- Issue date Mar 1, 2022
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning interconnect integration scheme with SAV
- Patent number 11,244,860
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded BEOL memory device with top electrode pillar
- Patent number 11,239,421
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Dexin Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures including self aligned vias
- Patent number 11,227,792
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tight pitch via structures enabled by orthogonal and non-orthogonal...
- Patent number 11,189,566
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Dongbing Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive memory crossbar array with top electrode inner spacers
- Patent number 11,038,104
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via design optimization to improve via resistance
- Patent number 10,915,690
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surface modified dielectric refill structure
- Patent number 10,886,168
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive memory crossbar array with top electrode inner spacers
- Patent number 10,672,980
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive memory crossbar array compatible with Cu metallization
- Patent number 10,672,984
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Takashi Ando
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resistive memory crossbar array compatible with Cu metallization
- Patent number 10,381,563
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Takashi Ando
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resistive memory crossbar array with top electrode inner spacers
- Patent number 10,361,367
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via formation using sidewall image transfer process to define later...
- Patent number 10,157,789
- Issue date Dec 18, 2018
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single damascene interconnect structure
- Patent number 9,508,647
- Issue date Nov 29, 2016
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via formation using sidewall image transfer process to define later...
- Patent number 9,490,168
- Issue date Nov 8, 2016
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single damascene interconnect structure
- Patent number 9,224,686
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile control in interconnect structures
- Patent number 9,105,641
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a profile control in interconnect structures
- Patent number 8,835,305
- Issue date Sep 16, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium-nitride removal
- Patent number 8,835,326
- Issue date Sep 16, 2014
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of air gap with protection of metal lines
- Patent number 8,754,520
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three photomask sidewall image transfer method
- Patent number 8,716,133
- Issue date May 6, 2014
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned dual damascene BEOL structures with patternable low- K...
- Patent number 8,519,540
- Issue date Aug 27, 2013
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with patternable low-k dielectrics and meth...
- Patent number 8,450,854
- Issue date May 28, 2013
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned dual damascene BEOL structures with patternable low-k...
- Patent number 8,415,248
- Issue date Apr 9, 2013
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of air gap with protection of metal lines
- Patent number 8,399,350
- Issue date Mar 19, 2013
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating back end of the line structures with liner a...
- Patent number 8,232,195
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with patternable low-k dielectrics and meth...
- Patent number 8,084,862
- Issue date Dec 27, 2011
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via gouging methods and related semiconductor structure
- Patent number 7,892,968
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing process induced dielectric damage by the use of...
- Patent number 7,838,428
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) WITH PRESERVED UNDERLY...
- Publication number 20230165156
- Publication date May 25, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DOUBLE PATTERNING (SADP) INTEGRATION WITH WIDE LINE SP...
- Publication number 20230136674
- Publication date May 4, 2023
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES INCLUDING SELF ALIGNED VIAS
- Publication number 20220093453
- Publication date Mar 24, 2022
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded BEOL Memory Device with Top Electrode Pillar
- Publication number 20210234095
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Dexin Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING INTERCONNECT INTEGRATION SCHEME WITH SAV
- Publication number 20210118732
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT INTEGRATION SCHEME WITH FULLY SELF-ALIGNED VIAS
- Publication number 20210118733
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES INCLUDING SELF ALIGNED VIAS
- Publication number 20210090942
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFIED DIELECTRIC REFILL STRUCTURE
- Publication number 20200388524
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA DESIGN OPTIMIZATION TO IMPROVE VIA RESISTANCE
- Publication number 20200327208
- Publication date Oct 15, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESISTIVE MEMORY CROSSBAR ARRAY WITH TOP ELECTRODE INNER SPACERS
- Publication number 20200220078
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES CONTAINING PATTERNABLE LOW-K DIELECTRICS AN...
- Publication number 20200219765
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVE MEMORY CROSSBAR ARRAY COMPATIBLE WITH CU METALLIZATION
- Publication number 20200028080
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Takashi Ando
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESISTIVE MEMORY CROSSBAR ARRAY WITH TOP ELECTRODE INNER SPACERS
- Publication number 20200028076
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHT PITCH VIA STRUCTURES ENABLED BY ORTHOGONAL AND NON-ORTHOGONAL...
- Publication number 20190318989
- Publication date Oct 17, 2019
- International Business Machines Corporation
- Dongbing Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMATION USING SIDEWALL IMAGE TRANFER PROCESS TO DEFINE LATERA...
- Publication number 20160358820
- Publication date Dec 8, 2016
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMATION USING SIDEWALL IMAGE TRANSFER PROCESS TO DEFINE LATER...
- Publication number 20160336225
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE DAMASCENE INTERCONNECT STRUCTURE
- Publication number 20160071802
- Publication date Mar 10, 2016
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK FACETING FOR ENHANCING METAL FILL IN TRENCHES
- Publication number 20150221547
- Publication date Aug 6, 2015
- STMicroelectronic, Inc.
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILE CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20150035154
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Titanium-Nitride Removal
- Publication number 20140312265
- Publication date Oct 23, 2014
- International Business Machines Corporation
- Shyng-Tsong Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THREE PHOTOMASK SIDEWALL IMAGE TRANSFER METHOD
- Publication number 20140057436
- Publication date Feb 27, 2014
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILE CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20140035142
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TITANIUM NITRIDE REMOVAL
- Publication number 20130200040
- Publication date Aug 8, 2013
- International Business Machines Corporation
- John A. Fitzsimmons
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Titanium-Nitride Removal
- Publication number 20130171829
- Publication date Jul 4, 2013
- International Business Machines Operation
- John A. Fitzsimmons
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FORMATION OF AIR GAP WITH PROTECTION OF METAL LINES
- Publication number 20130134590
- Publication date May 30, 2013
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K...
- Publication number 20120231622
- Publication date Sep 13, 2012
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF AIR GAP WITH PROTECTION OF METAL LINES
- Publication number 20110193230
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K...
- Publication number 20100314767
- Publication date Dec 16, 2010
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH PATTERNABLE LOW-K DIELECTRICS AND METH...
- Publication number 20100283157
- Publication date Nov 11, 2010
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH RECESSED DIELECTRIC ADJACENT A NOBLE METAL CAP
- Publication number 20100176514
- Publication date Jul 15, 2010
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Shyng-Tsong Chen

Person

Patents Grantslast 30 patents

Interconnect structures including self aligned vias

Interconnect integration scheme with fully self-aligned vias

Double patterning interconnect integration scheme with SAV

Embedded BEOL memory device with top electrode pillar

Interconnect structures including self aligned vias

Tight pitch via structures enabled by orthogonal and non-orthogonal...

Resistive memory crossbar array with top electrode inner spacers

Via design optimization to improve via resistance

Surface modified dielectric refill structure

Resistive memory crossbar array with top electrode inner spacers

Resistive memory crossbar array compatible with Cu metallization

Resistive memory crossbar array compatible with Cu metallization

Resistive memory crossbar array with top electrode inner spacers

Via formation using sidewall image transfer process to define later...

Single damascene interconnect structure

Via formation using sidewall image transfer process to define later...

Single damascene interconnect structure

Profile control in interconnect structures

Method of fabricating a profile control in interconnect structures

Titanium-nitride removal

Formation of air gap with protection of metal lines

Three photomask sidewall image transfer method

Self-aligned dual damascene BEOL structures with patternable low- K...

Interconnect structures with patternable low-k dielectrics and meth...

Self-aligned dual damascene BEOL structures with patternable low-k...

Formation of air gap with protection of metal lines

Method for fabricating back end of the line structures with liner a...

Interconnect structures with patternable low-k dielectrics and meth...

Via gouging methods and related semiconductor structure

Method of repairing process induced dielectric damage by the use of...

Patents Applicationslast 30 patents

MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) WITH PRESERVED UNDERLY...

SELF-ALIGNED DOUBLE PATTERNING (SADP) INTEGRATION WITH WIDE LINE SP...

INTERCONNECT STRUCTURES INCLUDING SELF ALIGNED VIAS

Embedded BEOL Memory Device with Top Electrode Pillar

DOUBLE PATTERNING INTERCONNECT INTEGRATION SCHEME WITH SAV

INTERCONNECT INTEGRATION SCHEME WITH FULLY SELF-ALIGNED VIAS

INTERCONNECT STRUCTURES INCLUDING SELF ALIGNED VIAS

SURFACE MODIFIED DIELECTRIC REFILL STRUCTURE

VIA DESIGN OPTIMIZATION TO IMPROVE VIA RESISTANCE

RESISTIVE MEMORY CROSSBAR ARRAY WITH TOP ELECTRODE INNER SPACERS

INTERCONNECT STRUCTURES CONTAINING PATTERNABLE LOW-K DIELECTRICS AN...

RESISTIVE MEMORY CROSSBAR ARRAY COMPATIBLE WITH CU METALLIZATION

RESISTIVE MEMORY CROSSBAR ARRAY WITH TOP ELECTRODE INNER SPACERS

TIGHT PITCH VIA STRUCTURES ENABLED BY ORTHOGONAL AND NON-ORTHOGONAL...

VIA FORMATION USING SIDEWALL IMAGE TRANFER PROCESS TO DEFINE LATERA...

VIA FORMATION USING SIDEWALL IMAGE TRANSFER PROCESS TO DEFINE LATER...

SINGLE DAMASCENE INTERCONNECT STRUCTURE

HARDMASK FACETING FOR ENHANCING METAL FILL IN TRENCHES

PROFILE CONTROL IN INTERCONNECT STRUCTURES

Titanium-Nitride Removal

THREE PHOTOMASK SIDEWALL IMAGE TRANSFER METHOD

PROFILE CONTROL IN INTERCONNECT STRUCTURES

TITANIUM NITRIDE REMOVAL

Titanium-Nitride Removal

FORMATION OF AIR GAP WITH PROTECTION OF METAL LINES

SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K...

FORMATION OF AIR GAP WITH PROTECTION OF METAL LINES

SELF-ALIGNED DUAL DAMASCENE BEOL STRUCTURES WITH PATTERNABLE LOW- K...

INTERCONNECT STRUCTURES WITH PATTERNABLE LOW-K DIELECTRICS AND METH...

INTERCONNECT WITH RECESSED DIELECTRIC ADJACENT A NOBLE METAL CAP