Shyue-Ter Leu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level package with polymer layer delamination prevention desi...
- Patent number 12,230,593
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,996,346
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having warpage control and method of f...
- Patent number 11,978,729
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with conductive line crack prevention design
- Patent number 11,854,956
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 11,855,009
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate insulation opening design
- Patent number 11,817,382
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 11,804,445
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,699,631
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 11,410,939
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,328,971
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate insulation opening design
- Patent number 11,251,114
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with lid
- Patent number 10,797,006
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,727,147
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with lid
- Patent number 10,163,816
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,109,547
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, L.L.C.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package on package structure and methods of form...
- Patent number 9,881,908
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with thermal dissipation structure and method for form...
- Patent number 9,870,975
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly, semiconductor package and forming m...
- Patent number 9,748,156
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) having a thermally enha...
- Patent number 9,721,868
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and manufacturing method thereof
- Patent number 9,653,391
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL
- Publication number 20240379640
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274493
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL
- Publication number 20240145448
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20240120294
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
- Publication number 20240096778
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Huei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-LESS PACKAGING SUBSTRATE MANUFACTURE METHOD AND STRUCTURES FO...
- Publication number 20240021437
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ching HSU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR
- Publication number 20230378079
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrate Insulation Opening Design
- Publication number 20230369193
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307310
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20230036317
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
- Publication number 20230016849
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Huei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...
- Publication number 20230012350
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220352083
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20220336377
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220270949
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INSULATION OPENING DESIGN
- Publication number 20220165655
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INSULATION OPENING DESIGN
- Publication number 20210343633
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20210013160
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200357714
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID
- Publication number 20190096826
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20190057916
- Publication date Feb 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORM...
- Publication number 20180019183
- Publication date Jan 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID
- Publication number 20170358542
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20170221788
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package on Package Structure and Methods of Form...
- Publication number 20170207204
- Publication date Jul 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED HEAT SPREADER
- Publication number 20150179617
- Publication date Jun 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS

Shyue-Ter Leu

Person

Patents Grantslast 30 patents

Wafer level package with polymer layer delamination prevention desi...

Semiconductor device and manufacturing method thereof

Semiconductor device package having warpage control and method of f...

Semiconductor die package with conductive line crack prevention design

Chip package with lid

Package substrate insulation opening design

Method for forming chip package structure

Semiconductor device and manufacturing method thereof

Chip package with lid

Semiconductor device and method of manufacture

Package substrate insulation opening design

Structure and formation method of chip package with lid

Semiconductor device and method of manufacture

Structure and formation method of chip package with lid

Semiconductor device and method of manufacture

Integrated fan-out package on package structure and methods of form...

Chip package with thermal dissipation structure and method for form...

Semiconductor package assembly, semiconductor package and forming m...

Three dimensional integrated circuit (3DIC) having a thermally enha...

Semiconductor packaging structure and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL

CHIP PACKAGE WITH LID

SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN

LASER-LESS PACKAGING SUBSTRATE MANUFACTURE METHOD AND STRUCTURES FO...

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR

Package Substrate Insulation Opening Design

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE WITH LID

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE INSULATION OPENING DESIGN

PACKAGE SUBSTRATE INSULATION OPENING DESIGN

CHIP PACKAGE WITH LID

Semiconductor Device and Method of Manufacture

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID

Semiconductor Device and Method of Manufacture

CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORM...

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID

Semiconductor Device and Method of Manufacture

Integrated Fan-Out Package on Package Structure and Methods of Form...

THERMALLY ENHANCED HEAT SPREADER