Si Hyun Choe

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Kyongggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Two step wire bond process
- Patent number 6,461,898
- Issue date Oct 8, 2002
- Motorola, Inc.
- Seok Mo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two step wire bond process
- Patent number 6,165,888
- Issue date Dec 26, 2000
- Motorola, Inc.
- Seok Mo Kwon
- H01 - BASIC ELECTRIC ELEMENTS